Display Edge Insulation Layout for Laser-Cut Bezel Reduction
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Solution Overview
Problem
Existing display devices suffer damage during the cutting process for separating them from manufacturing substrates, and the non-display areas are significant, limiting the potential for bezel-less designs.
Innovation Solution
The display device incorporates an organic layer-free area in the non-display regions, particularly the corners and outer edges, to minimize damage from laser cutting, thereby reducing the non-display area and enhancing the bezel-less design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the organic insulating layer is disposed in the non-display area including corner areas, then the protection and insulation are improved, but the damage from laser cutting process increases
Solution Approach 1:
The patent extracts the organic insulating layer from the corner areas of the non-display region, creating an organic layer-free area. This removal eliminates the harmful interaction between the organic layer and laser cutting process while maintaining the layer in areas where it provides beneficial protection and insulation.
Solution Approach 2:
The patent applies different structural configurations to different regions: the organic insulating layer is present in areas requiring protection and insulation, but absent in corner areas where laser cutting occurs. This local differentiation optimizes both protection functionality and resistance to cutting damage.
2Area of stationary object
If the non-display area is reduced to enable bezel-less design, then the screen area is improved, but the manufacturing precision requirement increases
Solution Approach 1:
The patent prepares the structure in advance by creating organic layer-free areas in corner regions before the laser cutting process. This preliminary configuration ensures that when cutting occurs, the laser can cleanly separate the display device from the manufacturing substrate without damaging the organic insulating layer, thereby reducing the required cutting precision.
3Reliability
If the organic insulating layer is disposed throughout the entire non-display area, then the insulation is improved, but the cutting tolerance decreases
Solution Approach 1:
The patent selectively removes the organic insulating layer from corner areas of the non-display region, creating designated organic layer-free areas. This extraction maintains insulation in critical regions while eliminating material that would interfere with the laser cutting process, thereby improving cutting tolerance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces substrate damage and minimizes the non-display area, enabling a larger screen with seamless tiling displays and improved manufacturing tolerance.
Implementation Method 1
When a laser beam is used to cut a substrate, an organic insulating layer disposed on the substrate may be damaged by the laser beam.
Data Source
AI summary
A display device including a display area and a non-display area, an inorganic insulating layer disposed on a substrate, the inorganic insulating layer disposed in the display area and the non-display area, pixels disposed on the substrate and overlapping the inorganic insulating layer in a plan view, the pixels disposed in the display area, and an organic insulating layer disposed on the substrate and overlapping the inorganic insulating layer and the pixels in a plan view, the organic insulating layer disposed at least in the display area. The non-display area includes an organic layer-free area including at least one of a corner and an outer edge area of the display device. The organic insulating layer is disposed on a portion of the substrate so as to be disposed in an area except for the organic layer-free area.