Display Substrate Edge Sealing Against Water and Oxygen Ingress

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Solution Overview

Problem

The existing display technologies face challenges in preventing water and oxygen intrusion into the display region, which can lead to the formation of Growing Dark Spots (GDS) due to the invalid encapsulation of the encapsulation layer.

Innovation Solution

A display substrate is designed with a base substrate, a power supply line, an organic insulating layer, and a metal protective structure. The power supply line is partially arranged in the first peripheral region of the base substrate and is electrically connected to the display units. The organic insulating layer includes organic grooves and isolation dams, and the metal protective structure covers the edges of the overlapping regions of the power supply line and the organic grooves, thereby blocking water and oxygen intrusion routes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the encapsulation layer is used to protect OLED display devices, then the display quality is improved, but cracks or invalid regions in the encapsulation layer lead to water and oxygen intrusion causing Growing Dark Spots

Engineering Contradiction:

Improveencapsulation effectivenessVSAvoidwater and oxygen intrusion

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies local quality by creating organic grooves at specific locations where the power supply line overlaps with the encapsulation layer. These grooves are strategically positioned to block water and oxygen intrusion routes at the most vulnerable points, rather than uniformly protecting the entire encapsulation layer. The metal protective structure is also locally applied at the overlapping regions to provide enhanced protection where needed.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The encapsulation layer is segmented into multiple regions by introducing organic grooves that divide the continuous layer. This segmentation creates isolated sections that prevent water and oxygen from spreading continuously across the encapsulation layer, thereby blocking intrusion routes and preventing GDS formation even if one segment is compromised.

Inventive Principle:

Principle #1Segmentation

2Object-affected harmful factors

If organic grooves are introduced to block water and oxygen routes, then protection against vapor ingress is improved, but the structural complexity of the encapsulation layer increases

Engineering Contradiction:

Improvevapor ingress preventionVSAvoidencapsulation layer structure

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The organic grooves are formed during the encapsulation layer fabrication process itself, before the final device assembly. This preliminary action integrates the protective grooves into the manufacturing flow without requiring additional complex steps, thereby blocking vapor ingress routes while minimizing increases in overall device complexity.

Inventive Principle:

Principle #10Preliminary action

3Reliability

If the metal protective structure covers the overlapping regions of the power supply line, then the reliability against water and oxygen intrusion is improved, but the manufacturing process complexity increases

Engineering Contradiction:

Improveprotection against water and oxygenVSAvoidmanufacturing process

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The metal protective structure is merged with the existing power supply line structure by positioning it to cover the overlapping regions where the power supply line intersects with the encapsulation layer. This combining approach provides enhanced protection at critical points while utilizing the existing manufacturing infrastructure, thereby improving reliability without proportionally increasing manufacturing complexity.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS12279494B2Display substrate and manufacturing method therefor, and display device

Publication Date: 2025.04.15 CHENGDU BOE OPTOELECTRONICS TECH CO LTD

AI summary

Provided is a display substrate. A base substrate includes a display region (100), a binding region located on one side of the display region (100), and a first peripheral region (200) located between the display region and the binding region. The display region (100) comprises multiple display units. A power line (210, 220) is disposed in the first peripheral region (200) of the base substrate, and is electrically connected to the display units. An organic insulating layer is disposed on the side of the power line away from the base substrate. In the first peripheral region (200), the organic insulating layer includes at least two organic grooves and an isolation dam (410, 420) disposed between every two adjacent organic grooves, and the organic grooves penetrate through the organic insulating layer.