Display Edge Solder Bonding for Narrow-Pitch Component Connections
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Solution Overview
Problem
Existing methods for connecting electronic components to substrates using anisotropic conductive films result in increased connection resistance and decreased insulating properties, particularly with narrow pitch line patterns, and require high positioning accuracy to avoid deviations during bonding.
Innovation Solution
A method involving the use of auto-agglutination solder with thermosetting resin and solder particles, along with a provisional junction substance of lower melting point, is applied to form a solder junction and resin adhesion part, ensuring precise alignment and reduced connection resistance by forming a solder metal bond and insulating resin attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If anisotropic conductive film with conductive particles dispersed in thermosetting resin is used to connect the line pattern of the substrate and the line connection part of the electronic component, then the electrical connection is established, but the connection resistance increases
Solution Approach 1:
The patent extracts the conductive particles from the thermosetting resin matrix and applies them directly to the line pattern surface. This separation allows the conductive particles to form direct contact paths for electrical connection while the thermosetting resin provides only the bonding function, thereby reducing connection resistance while maintaining electrical connectivity.
Solution Approach 2:
The patent creates different functional zones: conductive particles are concentrated at the line pattern surface for electrical connection, while the thermosetting resin provides bulk bonding. This local differentiation of material properties optimizes both electrical conductivity at the contact interface and mechanical bonding strength in the bulk.
2Reliability
If conductive particles dispersed in thermosetting resin are used for connection, then the line pattern and electronic component are electrically connected, but the insulating properties in the insulated part decrease
Solution Approach 1:
By extracting conductive particles from the bulk thermosetting resin and concentrating them only at the line pattern surface, the patent eliminates the presence of conductive particles in the insulated regions. This ensures that insulated parts maintain their insulating properties while the line pattern areas achieve good electrical connection.
3Manufacturing precision
If the pitch of the line pattern of the substrate is narrowed to 100 μm or less for finer display image, then the display resolution is improved, but the connection resistance increases and insulating properties decrease
Solution Approach 1:
The patent extracts conductive particles from the resin bulk and concentrates them on the line pattern surface, which is particularly effective for narrow pitch patterns. This ensures adequate electrical connection even when line spacing is reduced to 100 μm or less, while preventing conductive particles from bridging adjacent lines and compromising insulation.
Solution Approach 2:
The patent applies different material distributions to different regions: high concentration of conductive particles at line pattern surfaces for electrical connection, and pure thermosetting resin in insulated regions. This local quality differentiation enables successful connection of narrow pitch patterns while maintaining insulation between adjacent lines.
4Reliability
If the line pattern of the substrate and the line connection part of the electronic component are bonded to each other, then the electrical connection is established, but the line pattern and line connection part may be deviated
Solution Approach 1:
The patent applies conductive particles to the line pattern surface before bonding the electronic component. This preliminary action ensures that the conductive particles are already in position on the substrate, allowing for self-alignment during the bonding process and reducing the risk of deviation between the line pattern and line connection part.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method securely bonds electronic components to substrates with reduced connection resistance and improved insulating properties, maintaining high precision and mechanical strength, even with narrow pitch line patterns, and enhances the quality of display devices by reducing bezel width and increasing image quality in display systems.
Implementation Method 1
The auto-agglutination solder includes a thermosetting resin and a solder particle
Implementation Method 2
forming an auto-agglutination solder between the electronic component side line connection part and the substrate side line connection part
Implementation Method 3
the provisional junction substance formed of a material having a melting point lower than the solder particle... by softening the provisional junction substance at a temperature lower than a melting point of the solder particle
Implementation Method 4
by softening the provisional junction substance at a temperature lower than a melting point of the solder particle and the melting point of the provisional junction substance
Data Source
AI summary
A display device includes a substrate stack including two substrates, a line between the two substrates, and a substrate side line connection part at an end of the line. The display device also includes an electronic component having an electronic component side line connection part. The electronic component side line connection part faces a vertical end surface of the substrate stack. The display device further includes a junction part that electrically joins the vertical end surface and the electronic component. The junction part includes a solder junction part between the substrate side line connection part and the electronic component side line connection part, a resin adhesion part at a region outside the solder junction part that adheres the vertical end surface and the electronic component, and a low-melting junction part between the vertical end surface and the electronic component and formed of a material having a melting point lower than the solder particle.