Stretchable Display Substrate Edge Step for Encapsulation Release

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Solution Overview

Problem

In the preparation of stretchable display panels, the encapsulation layer on the display substrate is difficult to completely disconnect from the hard carrier plate during the removal process, leading to damage and cracks, which affects the encapsulation effect and limits stretchability.

Innovation Solution

A display substrate design with a stepped structure at the edge areas of hole openings, where the inorganic encapsulation layer is positioned on the stepped surface, allowing for complete etching and disconnection from the hard carrier plate, reducing damage during the removal process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the encapsulation layer is formed on the hard carrier plate surface exposed by hole openings, then the encapsulation coverage is improved, but the encapsulation layer cannot be completely disconnected from the hard carrier plate during removal, leading to damage and cracks

Engineering Contradiction:
Improveencapsulation effectVSAvoiddamage and cracks to encapsulation layer
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent divides the encapsulation layer into two separate segments: one on the display substrate and another on the hard carrier plate, with a gap between them. This segmentation allows the encapsulation layer on the display substrate to be completely disconnected from the hard carrier plate during removal, eliminating the harmful pulling force that causes damage and cracks.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent extracts the inorganic encapsulation layer from the hard carrier plate surface by forming it only on the display substrate within the island areas and bridge areas, deliberately excluding the hard carrier plate surface exposed by hole openings. This extraction eliminates the source of the problem where the encapsulation layer remains attached to the hard carrier plate.

Inventive Principle:
Principle #2Taking out (Extraction)

2Reliability

If the encapsulation layer is formed continuously across the hole area, then the encapsulation coverage is improved, but the stretchability is limited due to the constraint from the hard carrier plate

Engineering Contradiction:
Improveencapsulation effectVSAvoidstretchability
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent segments the encapsulation structure by creating discontinuous island areas and bridge areas separated by hole areas, with the inorganic encapsulation layer formed only within these segmented regions. This segmentation allows the display substrate to stretch independently in the hole areas without being constrained by a continuous encapsulation layer spanning across the hard carrier plate.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent applies different structural qualities to different regions: the inorganic encapsulation layer is present in island areas and bridge areas for protection, while intentionally absent in hole areas to enable stretching. This local differentiation of encapsulation quality achieves both protection where needed and flexibility where required.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS12557485B2Display substrate and manufacturing method therefor, and display device
Publication Date: 2026.02.17 BOE TECHNOLOGY GROUP CO LTD
  • US12557485B2 patent drawing
  • US12557485B2 patent drawing
  • US12557485B2 patent drawing

AI summary

A display substrate and a manufacturing method therefor, and a display device. The display substrate comprises a plurality of island areas that are spaced apart from each other, a plurality of hole areas, and bridge areas for connecting adjacent island areas. The island areas or/and the bridge areas comprise an edge area adjacent to the hole area; the edge area comprises a composite structure layer provided on a base substrate; a stepped structure is formed at a side surface of the composite structure layer facing the hole areas; the edge area further comprises an inorganic encapsulation layer disposed on the composite structure layer and the stepped structure.