Display Light Emitter Transfer with Pre-Transfer Inspection
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Solution Overview
Problem
It is challenging to perform an inspection process on light emitting elements before they are transferred to a backplane layer in the manufacturing of display devices, which affects the quality and efficiency of the manufacturing process.
Innovation Solution
A method involving a carrier module with a carrier wafer and light emitting elements is used, where the carrier module is disposed on a transparent electrode assembly, and the light emitting elements are inspected before being transferred onto a pixel-circuit layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the light emitting element is transferred directly to a backplane layer without intermediate inspection, then the manufacturing process is simplified, but the failure rate increases and quality control deteriorates
Solution Approach 1:
The manufacturing process is segmented into distinct stages: growth substrate stage, carrier wafer stage, and backplane layer stage. The inspection process is inserted at the carrier wafer stage, dividing the continuous manufacturing flow into manageable segments that allow for quality control without overwhelming complexity
Solution Approach 2:
The inspection process is performed preliminarily, before the light emitting element is transferred to the backplane layer. This preliminary inspection allows defects to be detected and addressed early in the manufacturing process, preventing waste of subsequent manufacturing steps
2Reliability
If the inspection process is performed before transferring the light emitting element to the backplane layer, then the failure rate decreases, but the manufacturing process becomes more complex
Solution Approach 1:
The inspection is performed as a preliminary action on the carrier wafer before the final transfer to the backplane layer. This timing allows for efficient batch inspection of multiple light emitting elements simultaneously, maintaining productivity while improving reliability through early defect detection
Solution Approach 2:
The carrier wafer serves as an intermediary substrate that facilitates the inspection process. By maintaining the light emitting elements on the carrier wafer during inspection, the system enables efficient electrical connection and optical measurement without requiring complex alignment with the backplane layer
3Measurement precision
If the light emitting element is inspected on the carrier wafer, then the inspection accuracy improves, but the process time increases
Solution Approach 1:
The inspection process is segmented into electrical signal application and optical output detection, performed sequentially on the carrier wafer. This segmentation allows for precise measurement of each parameter without requiring complex simultaneous measurements, maintaining accuracy while controlling process time
Solution Approach 2:
The light emitting element's own structure is utilized for inspection - the electrical signals are applied through the carrier wafer to the light emitting element, and the optical output is detected directly from the element itself. This self-service approach eliminates the need for external test equipment that would add time, while maintaining high measurement precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the failure rate of light emitting elements, improves process efficiency, and allows for an effective inspection process, thereby enhancing the overall quality of the display devices.
Implementation Method 1
an electrical signal for light emission is desired to be supplied to a light emitting element to perform an inspection process
Data Source
AI summary
A method of manufacturing a display device includes: providing a carrier module including a carrier wafer and light emitting elements; disposing the carrier module on a transparent electrode assembly; inspecting the light emitting elements; and transferring the light emitting elements onto a pixel circuit layer after the inspecting the light emitting elements.