Display Panel Encapsulation Etching to Prevent FMLOC Bubbles
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Solution Overview
Problem
The FMLOC display panel design is prone to bubble formation due to incomplete discharge of internal water vapor, leading to film layer separation, wrinkling, and poor touch control, which affects production yield and performance.
Innovation Solution
A manufacturing method involving the formation of an inorganic encapsulation layer with a main and infiltration layer, followed by simultaneous etching using a single mask to remove the infiltration layer, ensuring flush edges and preventing bubble formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an inorganic encapsulation layer is formed using vapor deposition method to cover the display area, then the encapsulation and protection performance is improved, but water vapor accumulates inside the film layers causing bubble formation
Solution Approach 1:
The patent applies preliminary action by forming the infiltration layer that extends from the main encapsulation layer towards the peripheral area before the actual encapsulation process. This infiltration layer creates preliminary pathways for water vapor discharge, preventing bubble formation within the film layers while maintaining the encapsulation structure's integrity
Solution Approach 2:
The patent creates a porous or permeable structure through the infiltration layer that extends from the main encapsulation layer. This layer acts as a controlled permeable pathway, allowing water vapor to escape while maintaining the overall encapsulation barrier function of the inorganic encapsulation layer
2Object-affected harmful factors
If the infiltration layer is not removed, then water vapor discharge pathways are maintained, but film layer separation and wrinkling occur due to bubble formation
Solution Approach 1:
The patent applies the extraction principle by selectively removing the infiltration layer from the peripheral area after it has served its purpose of preventing water vapor accumulation during manufacturing. This removal eliminates the source of potential bubbles while maintaining the main encapsulation layer's integrity, preventing film layer separation and wrinkling
Solution Approach 2:
The infiltration layer performs its water vapor discharge function preliminarily during manufacturing, then is removed after completing its protective role. This temporary structure prevents bubbles during critical manufacturing phases, then is extracted to maintain long-term film layer stability
3Reliability
If multiple inorganic layers are formed sequentially, then the encapsulation quality is improved, but the manufacturing process complexity increases
Solution Approach 1:
The patent merges the formation of the main encapsulation layer and the infiltration layer into a single vapor deposition process step. By forming both layers simultaneously in one process rather than sequentially, the encapsulation quality is maintained while reducing manufacturing process complexity and production time
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents bubble formation and ensures the integrity of the film layers, enhancing the yield and touch control performance of the FMLOC display panel.
Implementation Method 1
forming an inorganic encapsulation layer on the driving backplane using a vapor deposition method
Implementation Method 2
simultaneously etching the second inorganic layer and the infiltration layer using a same mask to remove the second inorganic layer and the infiltration layer
Data Source
AI summary
A manufacturing method for a display panel, the display panel, and a display device are provided. The manufacturing method includes: providing a driving backplane; forming an inorganic encapsulation layer on the driving backplane using a vapor deposition method, so that the inorganic encapsulation layer includes a main encapsulation layer covering the display area and a part of the peripheral area and an infiltration layer extending from the main encapsulation layer towards a direction away from the display area; forming an inorganic layer on a side of the inorganic encapsulation layer away from the driving backplane, so that the inorganic layer includes a first inorganic layer covering the main encapsulation layer and a second inorganic layer extending from the first inorganic layer towards the direction away from the display area; and simultaneously etching the second inorganic layer and the infiltration layer using a same mask to remove them.