Display Encapsulation Structure to Reduce Dead Space and Moisture Damage
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Solution Overview
Problem
Existing display apparatuses face challenges in minimizing the dead space or peripheral area, which affects the size of the display area and can lead to issues such as reduced lifespan and image quality defects due to moisture permeation and damage to conductive wires.
Innovation Solution
The display apparatus incorporates a conductive pattern with protrusion patterns and a dam portion in the peripheral area, along with multiple organic insulating layers and inorganic encapsulation layers, to enhance adhesion and protection, reducing dead space and improving reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the peripheral area is reduced to increase display area, then the display area size is improved, but the reliability deteriorates due to moisture permeation and conductive wire damage
Solution Approach 1:
The conductive wire structure transitions from a planar two-dimensional layout to a three-dimensional configuration by adding upper and lower conductive layers that overlap vertically. This dimensional change allows the conductive wire to extend beyond the pixel electrode area in the vertical dimension, providing extended protection against moisture permeation while maintaining a compact peripheral area.
Solution Approach 2:
The conductive wire is constructed as a composite structure with multiple material layers including a lower conductive layer, an intermediate layer, and an upper conductive layer. This composite structure combines different materials to simultaneously achieve electrical conductivity, mechanical strength, and moisture barrier properties, resolving the contradiction between reduced peripheral area and improved reliability.
2Ease of manufacture
If the conductive wire structure is simplified, then the manufacturing process is improved, but the lifespan deteriorates due to increased moisture permeation
Solution Approach 1:
The lower conductive layer is formed first as a preliminary structure before forming the pixel electrode and upper conductive layer. This preliminary action allows the conductive wire structure to be pre-positioned and extended beyond the pixel electrode area, providing advance protection against moisture permeation while maintaining a manageable manufacturing process through sequential layer formation.
Solution Approach 2:
The conductive wire structure employs a nested configuration where the upper conductive layer is positioned to overlap and extend beyond the lower conductive layer in the vertical dimension. This nested arrangement creates a protective envelope around the pixel electrode connection, extending moisture protection without significantly complicating the manufacturing process.
3Reliability
If the conductive wire is extended beyond pixel electrode area, then the moisture protection is improved, but the dead space increases
Solution Approach 1:
The conductive wire extension is achieved primarily in the vertical dimension through overlapping upper and lower layers rather than extensive horizontal expansion. This allows moisture protection to be enhanced by extending the conductive wire beyond the pixel electrode area in the vertical dimension while minimizing the increase in horizontal dead space.
Solution Approach 2:
The conductive wire structure applies different properties to different regions: the lower conductive layer provides base conductivity and protection, while the upper conductive layer specifically extends beyond the pixel electrode area in critical regions to provide enhanced moisture protection where needed, rather than uniformly increasing dead space across the entire display area.
Data Source
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AI summary
A display apparatus includes a substrate (100) including a display area (DA) and a peripheral area (PA) outside the display area, the peripheral area including an adhesion area (AA), a conductive pattern (110) in the adhesion area, a cover layer (121) covering at least a portion of an upper surface (110u) of the conductive pattern and a side surface (110s) of the conductive pattern, and an encapsulation layer (300) in the display area and the peripheral area and including a first inorganic encapsulation layer (310), an organic encapsulation layer (320), and a second inorganic encapsulation layer (330), wherein the first inorganic encapsulation layer directly contacts the cover layer and the second inorganic encapsulation layer in the adhesion area.