Display Encapsulation Structure for Glue Overflow and Pressure Resistance

Solution Overview

Problem

Existing encapsulating structures for miniature light-emitting diodes face issues with glue overflow and pressure resistance, as current methods either result in glue overflow due to fluidity or have poor pressure resistance due to low fluidity of soft films.

Innovation Solution

An encapsulating structure comprising a first encapsulating layer covering the components and a second encapsulating layer stacked away from the components, with the second layer's surface parallel to the plane, allowing for adjustable hardness and flexibility to prevent glue overflow and enhance pressure resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-generated harmful factors

If a soft film with low fluidity is used for encapsulation, then glue overflow is prevented, but pressure resistance performance deteriorates

Engineering Contradiction:

Improveglue overflowVSAvoidpressure resistance

Core Design Contradiction:

Object-generated harmful factorsVSStrength

Solution Approach 1:

The encapsulating structure is divided into multiple encapsulating layers (first, second, and third layers) with different material compositions and properties. Each layer serves a specific function: the first layer provides initial encapsulation, the second layer enhances pressure resistance, and the third layer provides final protection. This segmentation allows the system to prevent glue overflow while maintaining pressure resistance without relying on a single material.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent employs composite materials with varying viscosity characteristics across different encapsulating layers. The materials are formulated to have specific fluidity and hardness properties that complement each other, creating a multi-layer composite structure that simultaneously achieves glue overflow prevention and pressure resistance enhancement.

Inventive Principle:

Principle #40Composite materials

2Strength

If a material with high fluidity is used for encapsulation, then pressure resistance is improved, but glue overflow occurs

Engineering Contradiction:

Improvepressure resistanceVSAvoidglue overflow

Core Design Contradiction:

StrengthVSObject-generated harmful factors

Solution Approach 1:

The encapsulating structure is divided into multiple encapsulating layers (first, second, and third layers) with different material compositions and properties. Each layer serves a specific function: the first layer provides initial encapsulation, the second layer enhances pressure resistance, and the third layer provides final protection. This segmentation allows the system to prevent glue overflow while maintaining pressure resistance without relying on a single material.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent employs composite materials with varying viscosity characteristics across different encapsulating layers. The materials are formulated to have specific fluidity and hardness properties that complement each other, creating a multi-layer composite structure that simultaneously achieves glue overflow prevention and pressure resistance enhancement.

Inventive Principle:

Principle #40Composite materials

3Strength

If a rigid structure is used for encapsulation, then pressure resistance is improved, but flexibility and ease of peeling deteriorate

Engineering Contradiction:

Improvepressure resistanceVSAvoidflexibility and ease of peeling

Core Design Contradiction:

StrengthVSEase of operation

Solution Approach 1:

The encapsulating layers are designed with dynamic properties that allow them to transition between flexible and rigid states. The materials can exhibit flexibility during the encapsulation process for easy application and peeling, then transform to provide rigid pressure resistance when needed. This dynamic behavior is achieved through specific material formulations that respond to environmental conditions or processing parameters.

Inventive Principle:

Principle #15Dynamics

Data Source

PatentUS20240145645A1Encapsulating structure, display substrate and manufacturing method therefor, and display apparatus

Publication Date: 2024.05.02 SIT AUTONOMOUS AG

AI summary

The present disclosure provides an encapsulating structure, a display substrate and a manufacturing method therefor, and a display apparatus. The encapsulating structure is used for encapsulating components, and includes: a first encapsulating layer configured to cover the components; and a second encapsulating layer stacked with the first encapsulating layer; the second encapsulating layer is located on the side of the first encapsulating layer away from the components, a surface of the second encapsulating layer facing the first encapsulating layer is in contact with a surface of the first encapsulating layer facing the second encapsulating layer, and a surface of the second encapsulating layer away from the first encapsulating layer is substantially parallel to a plane where the encapsulating structure is located.