Layered Display Encapsulation for Crack-Resistant Moisture Protection

The patent employs a composite encapsulation structure combining multiple inorganic encapsulating layers with different properties (first and second inorganic encapsulating layers) and organic encapsulating layers. This multi-material approach creates a synergistic barrier system where each layer contributes to moisture protection, resolving the contradiction by achieving high reliability through material composition rather than simple structure

The patent implements a nested encapsulation architecture where the first inorganic encapsulating layer is positioned between the device substrate and organic encapsulating layer, the second inorganic encapsulating layer is disposed on the organic encapsulating layer, and additional protective layers are stacked sequentially. This nested arrangement creates multiple barrier interfaces that collectively prevent moisture penetration while maintaining a compact overall structure

The patent applies different material properties and structural characteristics to different regions of the encapsulation system. The first inorganic encapsulating layer has specific properties optimized for adhering to the device substrate, while the second inorganic encapsulating layer is configured to protect the organic encapsulating layer. This local differentiation allows each region to optimize its function, preventing uniform stress distribution that leads to cracks

By combining inorganic encapsulating layers with organic encapsulating layers and insulating layers, the patent creates a composite structure where each material type compensates for the weaknesses of others. The organic layers provide flexibility and stress relief, while inorganic layers provide barrier properties, collectively preventing crack formation and moisture penetration