LED Display Encapsulation Layout for Bonding Pad Access
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Solution Overview
Problem
The encapsulation glue layer in light-emitting diode display panels covers both the light-emitting diode elements and the bonding pads, making it difficult to bond the bonding pads with a driving circuit board.
Innovation Solution
A display apparatus with a circuit substrate, light-emitting elements, bonding pads, and an encapsulation glue layer, where the encapsulation glue layer has a flat portion covering the light-emitting elements and a thick wall portion extending to the connection area, allowing for easier access and bonding of the bonding pads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the encapsulation glue layer covers the light-emitting diode elements for protection, then the light-emitting diode elements are protected, but the bonding pads on the outer lead bonding area are also covered, causing inconvenience in subsequent bonding with driving circuit board
Solution Approach 1:
The encapsulation glue layer is divided into two distinct regions: a first region that covers the light-emitting diode elements for protection, and a second region that exposes the bonding pads for bonding operations. This segmentation allows the same encapsulation layer to serve dual functions of protection and accessibility.
Solution Approach 2:
Different regions of the encapsulation glue layer have different properties: the first region has full coverage for protection, while the second region has reduced coverage to expose bonding pads. This local differentiation in quality allows simultaneous achievement of element protection and bonding accessibility.
2Stability of the object's composition
If a uniform thickness encapsulation glue layer is used to cover the light-emitting diode elements, then the protection is consistent, but it is difficult to access the bonding pads for bonding
Solution Approach 1:
The encapsulation glue layer is segmented into different thickness regions: a first thickness in the first region for uniform protection, and a second reduced thickness in the second region for bonding pad accessibility. This segmentation resolves the contradiction between uniform protection and bonding access.
Solution Approach 2:
The encapsulation glue layer exhibits local quality variation in thickness: thicker in regions requiring protection and thinner in regions requiring access. This local differentiation maintains compositional stability where needed while enabling operational accessibility where required.
3Reliability
If the encapsulation glue layer is made thicker to improve protection, then the protective effect is enhanced, but the bonding pads become more difficult to access
Solution Approach 1:
The encapsulation glue layer is segmented with different thicknesses: a first thickness providing enhanced protection and a second reduced thickness providing accessibility. This segmentation allows the structure to simultaneously achieve both enhanced protection and accessibility without compromise.
Solution Approach 2:
The encapsulation glue layer has locally differentiated thickness quality: thicker regions provide enhanced protective effect while thinner regions provide improved accessibility. This local quality variation resolves the contradiction between protection enhancement and accessibility maintenance.
Data Source
AI summary
A display apparatus includes a circuit substrate, light-emitting elements, a bonding pad and an encapsulation glue layer. The circuit substrate has a display area, an outer lead bonding area and a connection area connected between the display area and the outer lead bonding area. The light emitting elements are disposed on the display area of the circuit substrate. The bonding pad is disposed on the outer lead bonding area of the circuit substrate. The encapsulation glue layer is disposed on the circuit substrate and includes a flat portion and a thick wall portion connected with each other. The flat portion covers the light emitting elements. The thick wall portion extends to the connection area. The thick wall portion has a thickness which gradually increases toward the outer lead bonding area. In addition, an array substrate is also provided.