Display Module Encapsulation Layout for Moisture-Safe Touch Areas
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing display modules suffer from high defect rates due to structural vulnerabilities, particularly in the non-display areas where touch sensing units are integrated.
Innovation Solution
A display module design incorporating a base layer, circuit device layer, display device layer, thin film encapsulation layer, and touch sensing layer, with specific structural features such as intermediate inorganic and organic layers, protrusion parts, and encapsulation layers to enhance durability and reduce defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional display module structure is used, then manufacturing is simpler, but defect rates are high due to structural vulnerabilities in non-display areas
Solution Approach 1:
The encapsulation layer is segmented into multiple regions with different thicknesses: a first region over the display area and a second region over the non-display area. This segmentation allows each region to be optimized for its specific function - the first region provides robust protection for display elements while the second region maintains touch sensitivity without excessive thickness that would cause defects
Solution Approach 2:
Different regions of the encapsulation layer are assigned different local qualities through varying thickness. The first region has greater thickness to protect moisture-sensitive display components, while the second region has reduced thickness to maintain touch sensitivity and reduce structural vulnerabilities in the non-display area
2Object-affected harmful factors
If the encapsulation layer is made uniformly thick to protect against moisture, then protection is improved, but touch sensitivity deteriorates due to excessive thickness in non-display areas
Solution Approach 1:
The encapsulation layer implements local quality by having different thicknesses in different regions. The first region over the display area is thicker to provide superior moisture protection for vulnerable display components, while the second region over the non-display area is thinner to maintain touch sensitivity and responsiveness
Solution Approach 2:
The encapsulation layer is divided into functionally distinct segments: a first region for moisture protection and a second region for touch sensitivity. This segmentation resolves the contradiction by allowing each region to be optimized for its primary function without compromising the other
3Ease of manufacture
If the intermediate organic layer covers the entire intermediate inorganic layer, then manufacturing is easier, but touch sensing performance deteriorates due to lack of exposed inorganic layer for electrode contact
Solution Approach 1:
The intermediate organic layer is intentionally not extended to cover the entire intermediate inorganic layer. Instead, portions of the intermediate inorganic layer are extracted or exposed in the non-display area to serve as contact surfaces for touch sensing electrodes, enabling proper touch sensing functionality
Solution Approach 2:
The exposed intermediate inorganic layer acts as an intermediary contact surface between the touch sensing electrodes and the underlying circuit structures. This intermediate layer provides a stable electrical contact interface that enables reliable touch sensing while maintaining manufacturing feasibility
Data Source
AI summary
A display module includes a display area and a non-display area disposed outside the display area on a plane. The display module includes a base layer, a circuit device layer, a display device layer, a thin film encapsulation layer, and a touch sensing layer. An inorganic layer of the touch sensing layer contacts an inorganic layer of the circuit device layer exposed by an organic layer of the circuit device layer. An inorganic layer of the thin film encapsulation layer is disposed between the inorganic layer of the touch sensing layer and the inorganic layer of the circuit device layer to block a moisture penetration path which causes delamination of the thin film encapsulation layer.