Display ESD Protection Layout to Prevent Metal Layer Shorting
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Solution Overview
Problem
Existing electrostatic protection structures in electronic devices are prone to short-circuiting due to insulating layer breaks, leading to adjacent metal layers short-circuiting and panel disablement during electrostatic discharge.
Innovation Solution
The electrostatic protection structure includes a first metal layer with non-overlapping portions and a second metal layer connected by a third portion, with insulating layer in between, designed to bypass potential discharge points, preventing short-circuiting by maintaining spatial hindrance and using semiconductor layers to enhance electrostatic protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the insulating layer is placed directly above the edges of adjacent metal lines for electrostatic protection, then the electrostatic discharge protection is improved, but the risk of short-circuit between metal layers increases when the insulating layer breaks
Solution Approach 1:
The second metal layer is divided into multiple separate portions (third portion, fourth portion, and connecting portion) that are spatially separated from the first metal layer. This segmentation ensures that even if the insulating layer breaks, the metal portions cannot form a continuous short-circuit path, thus resolving the contradiction between providing electrostatic protection and preventing short-circuits.
Solution Approach 2:
The insulating layer serves as an intermediary barrier between the first and second metal layers. By positioning the connecting portion of the second metal layer to not overlap with the first metal layer, the insulating layer effectively mediates the interaction between metal layers, allowing electrostatic protection while preventing direct contact that would cause short-circuits.
2Area of stationary object
If metal layers are positioned to overlap for compact design, then space utilization is improved, but the likelihood of short-circuit increases during electrostatic discharge
Solution Approach 1:
The second metal layer is segmented into discrete portions (third and fourth portions) with a connecting portion that bridges them. This segmentation allows the structure to maintain compact spacing for good space utilization while ensuring that no single continuous metal path directly overlaps with the first metal layer, thereby preventing short-circuits during electrostatic discharge.
Solution Approach 2:
The design applies different spatial relationships to different portions of the metal layers. The third and fourth portions are positioned to overlap with gaps in the first metal layer for compactness, while the connecting portion is specifically positioned to not overlap with the first metal layer, creating local quality differences that simultaneously achieve space utilization and anti-static protection.
Data Source
AI summary
An electronic device is provided. The electronic device includes a substrate including a display area and a peripheral area surrounding the display area, and an electrostatic protection structure disposed in the peripheral area. The electrostatic protection structure includes a first metal layer, an insulating layer and a second metal layer. The first metal layer includes an adjacent first portion and a second portion. The insulating layer is disposed on the first metal layer. The second metal layer is disposed on the insulating layer and includes a third portion, a fourth portion and a connecting portion between the third portion and the fourth portion. In a schematic top view, the first portion overlaps the third portion. The second portion overlaps the fourth portion. The connecting portion does not overlap the first metal layer.