Display Module ESD Wiring Layout for Micro LED Protection
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Solution Overview
Problem
Existing display modules face challenges in protecting against electrostatic discharge (ESD) due to the difficulty in mounting ESD protection devices for ultra-small light emitting diodes, which increases processing time and may leave fine gaps unprotected.
Innovation Solution
The display module incorporates ESD protection wiring arranged along the upper and lower sides of the substrate, with insulation layers exposing portions of the wiring to effectively connect and protect against ESD, reducing the need for dense ESD device placement and minimizing gaps between the substrate and non-conductive materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a number of ESD protection devices corresponding to the number of pixels is mounted in the display module, then ESD protection coverage is improved, but the space required for mounting increases and processing time is increased
Solution Approach 1:
The ESD protection wiring is divided into multiple segments arranged along the upper and lower sides of the substrate. Each segment corresponds to a specific region, allowing selective mounting and processing without requiring all segments to be processed simultaneously, thereby reducing overall processing time while maintaining comprehensive ESD protection coverage.
Solution Approach 2:
The ESD protection structure transitions from a two-dimensional planar arrangement to a three-dimensional configuration by arranging wiring segments along both the upper and lower sides of the substrate. This spatial optimization allows for more efficient use of available space and enables parallel processing of different segments, reducing processing time while maintaining comprehensive protection coverage.
2Reliability
If ESD protection devices are densely arranged to protect fine gaps, then ESD protection effectiveness is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The ESD protection wiring is configured with varying densities in different regions of the substrate. Areas with fine gaps or higher ESD risk have denser wiring segments, while other areas have sparser arrangements. This localized optimization provides effective ESD protection where needed without unnecessarily increasing overall device complexity and manufacturing difficulty.
3Productivity
If ESD protection wiring is arranged along upper and lower sides of the substrate, then ESD protection efficiency is improved and processing time is reduced, but the area occupied by wiring increases
Solution Approach 1:
The ESD protection wiring utilizes the vertical dimension by arranging segments along both the upper and lower sides of the substrate. This three-dimensional arrangement allows the wiring to protect a larger surface area without proportionally increasing the planar footprint, as the wiring segments are distributed across different vertical levels and along the periphery of the substrate.
Data Source
AI summary
A display module including a substrate including a plurality of first electrode pads at a rear surface; a plurality of light emitting diode packages including a plurality of second electrode pads on which a plurality of light emitting diodes are provided at a front surface of the substrate, where the plurality of second electrode pads are configured to electrically connect to the plurality of first electrode pads; and a first electrostatic discharge (ESD) protection wiring provided discontinuously along a first side of the substrate at the front surface of the substrate.