Display Module Fan-Out Trace Layout for Narrow-Border Stability
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Solution Overview
Problem
The high defect rate and instability of display modules with narrow borders due to excessive lateral etching and large taper angles in trace layers, leading to virtual connections or fractures, affect product yield and stability.
Innovation Solution
A display module design with overlapping trace layers and shifted arrangements of trace portions to reduce taper angles and increase climbing positions, ensuring stable and reliable connections between trace layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If trace layers are arranged with complete overlap and flush edges to save layout space, then area utilization is improved, but manufacturing precision deteriorates due to excessive lateral etching and large taper angles causing virtual connections or fractures
Solution Approach 1:
The patent divides the trace structure into multiple target portions (first target portion, second target portion, third target portion) across different trace layers. Each target portion is independently positioned and sized, allowing precise control over etching boundaries and taper angles. This segmentation enables the trace layers to overlap without complete flush alignment, preventing excessive lateral etching while maintaining compact layout.
Solution Approach 2:
The patent applies different geometric configurations to different portions of the trace structure. Specifically, the first, second, and third target portions have different positions and sizes relative to each other, creating localized variations in the overlap pattern. This local quality approach allows certain regions to have reduced taper angles and controlled lateral etching, improving manufacturing precision in critical areas while maintaining overall space efficiency.
2Adaptability or versatility
If border size is reduced continuously to achieve narrow border display modules, then adaptability is improved, but reliability deteriorates due to higher requirements on wiring in the fan-out region
Solution Approach 1:
The patent resolves the wiring reliability issue by transitioning from a two-dimensional planar arrangement to a three-dimensional stacked arrangement. Multiple trace layers are positioned at different heights (Z-dimension) above the base substrate, with target portions overlapping in the XY-plane but separated vertically. This dimensional change allows compact fan-out region wiring while maintaining adequate spacing and connection stability, enabling narrow border designs without compromising reliability.
3Manufacturing precision
If taper angles are reduced and climbing positions are increased to prevent virtual connections and fractures, then manufacturing precision is improved, but device complexity increases due to multiple trace layers with shifted arrangements
Solution Approach 1:
The patent implements a nested structure where multiple trace layers are stacked vertically, with each layer's target portion positioned within the projection area of the layers below. The first target portion, second target portion, and third target portion are nested in sequence, creating a compact vertical arrangement. This nesting approach consolidates multiple traces into a compact structure, reducing the overall device footprint while maintaining precise control over taper angles and connection stability.
Data Source
AI summary
Provided is a display module. The display module includes: a base substrate, including a display region and a fan-out region on a side of the display region; a first trace layer disposed on a side of the base substrate and disposed in the fan-out region; a first insulating layer disposed on a side of the first trace layer away from the base substrate; a second trace layer disposed on a side of the first insulating layer away from the base substrate and disposed in the fan-out region; a second insulating layer disposed on a side of the second trace layer away from the base substrate; and a third trace layer disposed on a side of the second insulating layer away from the base substrate and disposed in the fan-out region.