Electronic Element Layout for Integrated Display and Fingerprint Modules
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Solution Overview
Problem
Manufacturing electronic devices with multiple integrated functions, such as display and fingerprint recognition, poses challenges in efficiently arranging and connecting different electronic elements while minimizing light interference and ensuring proper electrical connections.
Innovation Solution
A manufacturing method involving the formation of a substrate with conductive and insulating layers, patterning to create specific openings, and positioning first and second electronic elements with different functions, along with light-shielding and light-converting elements to manage light interaction and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple electronic elements are integrated on a single substrate, then the device functionality is enhanced, but the interference between electronic elements increases
Solution Approach 1:
The patent divides the substrate into multiple isolated regions separated by insulating structures. Each electronic element (display element, fingerprint recognition element, image capture element) is positioned in a separate region, physically segmenting them to prevent mutual interference while maintaining integration on a single substrate.
Solution Approach 2:
The patent introduces light-shielding layers and insulating layers as intermediary structures between different electronic elements. These intermediary layers act as barriers that block harmful interactions (such as light interference) between adjacent elements while allowing each element to function independently.
2Area of stationary object
If multiple electronic elements are disposed close to each other, then the device area is reduced, but the manufacturing precision requirement increases
Solution Approach 1:
The patent forms insulating layers and light-shielding layers in advance before positioning the electronic elements. These pre-formed structures serve as guides and barriers that facilitate precise positioning of subsequent elements, reducing the difficulty of achieving high manufacturing precision when elements are disposed close together.
Solution Approach 2:
The patent applies different insulating and light-shielding properties to different regions of the substrate according to the specific requirements of each electronic element. This localized approach allows for optimized positioning and spacing of each element, maintaining high manufacturing precision while minimizing overall device area.
3Object-affected harmful factors
If light-shielding layers are added between electronic elements, then the interference is reduced, but the device complexity increases
Solution Approach 1:
The patent designs the insulating layers to serve multiple functions simultaneously: they provide electrical insulation between electronic elements, act as light-shielding barriers, and serve as structural support for positioning elements. This multi-functionality reduces the need for separate dedicated light-shielding layers, thereby limiting the increase in device complexity.
Data Source
AI summary
The disclosure provides a manufacturing method of an electronic device, including the following steps. A substrate is provided. A conductive layer is formed on the substrate. An insulating layer is formed on the conductive layer. The insulating layer is patterned to form a first opening and a second opening. A first electronic element is disposed in the first opening and the first electronic element is electrically connected to the conductive layer. A second electronic element is disposed in the second opening and the second electronic element is electrically connected to the conductive layer. The first electronic element and the second electronic element have different functions.