Display Module Flex Layout for High-Density Bonding Alignment
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Solution Overview
Problem
Existing flexible circuit boards with large lengths and high conductive contact piece density face challenges in meeting bonding requirements for high pixel density display panels, leading to misalignment and interference issues during the tiling of display devices.
Innovation Solution
The use of two flexible circuit boards with smaller lengths, arranged in a one-up-one-down dislocation manner, where one is closer to the selected side edge than the other, to avoid overlap and interference, while meeting bonding tolerance requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a single flexible circuit board with large length and high conductive contact piece density is used, then bonding requirements for high pixel density display panels can be met, but misalignment and interference issues occur during tiling of display devices
Solution Approach 1:
The patent divides a single large flexible circuit board into multiple smaller flexible circuit boards (first flexible circuit board and second flexible circuit board). Each smaller board has lower conductive contact piece density and is positioned separately, eliminating mutual interference while collectively meeting the bonding requirements for high pixel density display panels through coordinated arrangement.
2Object-generated harmful factors
If two flexible circuit boards are used to avoid interference, then mutual interference is eliminated, but device complexity increases
Solution Approach 1:
The patent resolves the complexity issue by arranging the two flexible circuit boards in different spatial positions (first flexible circuit board at first position, second flexible circuit board at second position) rather than increasing complexity within a single plane. This spatial dimensionality change allows separate positioning that avoids interference while maintaining manageable device structure.
Data Source
AI summary
A display module includes a display panel with a plurality of bonding electrodes arranged at intervals along a selected side edge of a non-display surface and divided into two bonding electrode groups, a first flexible circuit board and a second flexible circuit board. For the first flexible circuit board, each first conductive contact piece in a first wiring region is connected to a bonding electrode in a first bonding electrode group. For the second flexible circuit board, each second conductive contact piece in a second wiring region is connected to a bonding electrode in a second bonding electrode group. The first wiring region is closer to the selected side edge than the second wiring region in a first direction. The first fan-out region is spaced apart from the second wiring region in a second direction perpendicular to the first direction.