Display FPC Bridge Layout for Connector-Free Touch Bonding
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Solution Overview
Problem
Existing display apparatuses with flexible multi-layer on cell (FMLOC) structures face inefficiencies in connecting the flexible printed circuit (FPC) to the display panel, leading to increased labor costs and connector area usage due to manual insertion and large connector structures.
Innovation Solution
The display apparatus incorporates a main FPC and a bridge FPC with specific soldering regions and touch connection lines, along with shielding transfer lines, to facilitate efficient electrical connections and reduce interference, eliminating the need for manual connectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual insertion methods are used to connect FPC to display panel, then connection reliability is improved, but labor costs and manufacturing complexity increase
Solution Approach 1:
The patent replaces manual mechanical insertion operations with automated bonding technology. The FPC is directly bonded to the display panel through automated bonding processes, eliminating the need for manual connector insertion while ensuring reliable electrical connections. This substitution reduces labor costs and manufacturing complexity while maintaining connection reliability.
2Stability of the object's composition
If large connector structures are used to connect FPC to display panel, then connection stability is improved, but connector area and device size increase
Solution Approach 1:
The patent merges the FPC directly with the display panel through bonding technology, eliminating the need for separate large connector structures. The connection interface is integrated into the bonding region of the FPC, which directly bonds to the display panel. This merging approach maintains connection stability while significantly reducing the connector area and overall device size.
3Productivity
If automated bonding is used to connect FPC to display panel, then manufacturing efficiency is improved, but bonding precision requirements increase
Solution Approach 1:
The patent incorporates bonding pins and pads in advance during FPC fabrication, preparing the bonding interface before the actual bonding process. The bonding region is pre-configured with electrical connection structures, allowing automated bonding to proceed with high precision. This preliminary preparation enables automated bonding to achieve both high manufacturing efficiency and required bonding precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances manufacturing efficiency, reduces labor costs, and minimizes connector area, while ensuring reliable electrical connections and reduced signal interference in the display apparatus.
Implementation Method 1
the bonding pin electrically connected to a first touch lead
Implementation Method 2
The plurality of pads are disposed on the first soldering region and the second soldering region
Data Source
AI summary
A display apparatus includes a display panel, a touch layer, and a flexible printed circuit (FPC) including a main FPC and a bridge FPC. A third soldering region and a fourth soldering region of the bridge FPC are respectively soldered to a first soldering region and a second soldering region of the main FPC. Ends of each first touch connection line are electrically connected to a touch chip and a first touch lead. Ends of each second touch connection line are electrically connected to a pad on the second soldering region and a second touch lead. Ends of each third touch connection line are electrically connected to a pad on the first soldering region and the touch chip. Ends of each touch transfer line are electrically connected to a pad on the third soldering region and a pad on the fourth soldering region.