Display FPC Bridge Soldering Layout for Compact Touch Connections
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Solution Overview
Problem
Current display apparatuses with flexible multi-layer on cell (FMLOC) structures face challenges in efficiently connecting flexible printed circuits (FPCs) due to large connector structures that occupy significant area, increase labor costs, and are inefficient in manufacturing, particularly in the connection between the main FPC and bridge FPC.
Innovation Solution
The display apparatus incorporates a main FPC and a bridge FPC with a novel configuration, including specific soldering regions, shielding transfer lines, and a unique arrangement of pads and transfer lines, which allows for efficient soldering and reduced interference, improving manufacturing efficiency and cost-effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional connector structures are used to connect main FPC and bridge FPC, then reliable electrical connection is achieved, but the connector occupies significant area and increases device complexity
Solution Approach 1:
The patent merges the connector structure with the FPC substrate by directly forming soldering pads on the FPC board. The main FPC and bridge FPC are connected through soldering pads that are integrated into the FPC layers, eliminating the need for separate connector components. This integration reduces device complexity while maintaining reliable electrical connection through direct solder joints.
Solution Approach 2:
The FPC substrate serves multiple functions: it provides mechanical support, electrical connection pathways, and soldering surfaces for connecting both the main FPC and bridge FPC. The soldering pads on the FPC perform both as connection points and as structural integration elements, reducing the need for dedicated connector components.
2Reliability
If traditional connector structures are used to connect main FPC and bridge FPC, then electrical connection is established, but manufacturing labor cost and time increase
Solution Approach 1:
By integrating the connector functionality into the FPC substrate itself, the manufacturing process is simplified. The soldering pads are formed as part of the FPC fabrication process, and the connection between main FPC and bridge FPC is achieved through direct soldering to these integrated pads, eliminating separate connector assembly steps and reducing labor time.
Solution Approach 2:
The soldering pads are pre-formed on the FPC substrate during the FPC manufacturing process, before the actual connection assembly. This preliminary preparation of connection points streamlines the subsequent assembly process, allowing for faster and more efficient manufacturing without compromising connection reliability.
3Reliability
If shield lines are added to prevent signal interference between touch leads and data leads, then signal integrity is improved, but the FPC area and complexity increase
Solution Approach 1:
Shielding is applied locally only in the specific regions where signal interference is most critical, rather than throughout the entire FPC. The shield lines are positioned between the touch leads and data leads in the connection region, providing targeted electromagnetic shielding where needed while minimizing the overall area occupied by shielding structures.
Solution Approach 2:
The shield lines act as intermediary elements that are strategically placed between the touch leads and data leads to block electromagnetic interference. These shield lines serve as a mediating structure that protects sensitive signals without requiring extensive shielding coverage across the entire FPC area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the manufacturing efficiency and reduces costs by simplifying the connection process between the main and bridge FPCs, resulting in a more compact and cost-effective display apparatus with improved signal integrity.
Implementation Method 1
A pad on the first soldering region is soldered to a corresponding pad on the third soldering region, and a pad on the second soldering region is soldered to a corresponding pad on the fourth soldering region
Data Source
AI summary
A display apparatus includes a display panel, a touch layer, and a flexible printed circuit (FPC) including a main FPC and a bridge FPC. A third soldering region and a fourth soldering region of the bridge FPC are respectively soldered to a first soldering region and a second soldering region of the main FPC. Ends of each first touch connection line are electrically connected to a touch chip and a first touch lead. Ends of each second touch connection line are electrically connected to a pad on the second soldering region and a second touch lead. Ends of each third touch connection line are electrically connected to a pad on the first soldering region and the touch chip. Ends of each touch transfer line are electrically connected to a pad on the third soldering region and a pad on the fourth soldering region.