Display-to-Middle-Frame Bonding With Low-Modulus Colloid Buffer
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Solution Overview
Problem
The bonding strength between the display screen and the middle frame in electronic devices is weak, leading to potential warping and ingress of dust or water vapor, which compromises the reliability and user experience.
Innovation Solution
The use of a second colloid with a lower elastic modulus and shear strength than the first colloid, bonded between the display screen's fixed portion and the middle frame's groove bottom wall, enhances bonding reliability and absorbs impact stress, preventing detachment of the first colloid and maintaining display integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a cover is used to bond the display screen to the middle frame, then the bonding structure is simple, but the bonding strength is weak
Solution Approach 1:
The bonding structure is divided into two functional segments: the first colloid provides primary bonding between the fixed portion and the first main body portion, while the second colloid provides secondary bonding between the fixed portion and the groove bottom wall. This segmentation allows each colloid to be optimized for its specific function, with the second colloid having lower elastic modulus to prevent stress transmission to the display screen.
Solution Approach 2:
The second colloid acts as an intermediary element between the fixed portion and the groove bottom wall. It serves as a buffer that absorbs impact stress and prevents direct force transmission to the display screen, while still maintaining the bonding structure's integrity.
2Reliability
If the bonding structure is strengthened, then bonding reliability is improved, but the display screen may be subjected to stress affecting display quality
Solution Approach 1:
Different colloids are assigned different mechanical properties at different locations: the first colloid has higher elastic modulus for strong bonding at the fixed portion-display screen interface, while the second colloid has lower elastic modulus (≤5 MPa) for stress absorption at the fixed portion-middle frame interface. This local differentiation of material properties resolves the contradiction between bonding strength and stress protection.
Solution Approach 2:
The elastic modulus parameter of the second colloid is specifically controlled to be less than or equal to 5 MPa, which is significantly lower than that of the first colloid. This parameter change enables the second colloid to deform elastically under impact, absorbing stress energy while protecting the display screen from harmful forces.
3Object-affected harmful factors
If the second colloid has low elastic modulus to absorb impact stress, then the display screen is protected from stress, but the bonding strength between the fixed portion and middle frame may be reduced
Solution Approach 1:
The bonding function is segmented between two colloids with different properties. The first colloid provides the primary bonding strength, while the second colloid provides stress absorption. This segmentation allows the second colloid to have low elastic modulus without compromising overall bonding strength, as the first colloid compensates for any weakness in the second colloid's bonding contribution.
Solution Approach 2:
The bonding system uses a composite structure of two different colloidal materials with complementary properties. The first colloid provides high strength bonding, while the second colloid provides low elastic modulus for stress absorption. Together, they form a composite bonding system that achieves both strong bonding and stress protection simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves the bonding reliability between the display screen and the middle frame, preventing stress on the display screen and enhancing the device's sealing, thus ensuring the reliability and display quality.
Implementation Method 1
when the electronic device is impacted, the second colloid has good elastic deformation performance, which can absorb impact stress and further perform elastic deformation
Implementation Method 2
The first colloid is bonded between the fixed portion and the first main body portion
Implementation Method 3
At least a part of the second colloid is bonded between the groove bottom wall and the fixed portion
Data Source
AI summary
A middle frame of an electronic device has an accommodating groove, and the accommodating groove includes a groove bottom wall. At least a part of the display screen is located in the accommodating groove. On the display screen, a fixed portion is located on a back side of a first main body portion, and a bending portion is connected between an edge of the first main body portion and the fixed portion. A first colloid is bonded between the fixed portion and the first main body portion. At least a part of a second colloid is bonded between the groove bottom wall and the fixed portion. An elastic modulus of the second colloid is less than or equal to 5 MPa.