Display Frame Module Thinning via Hot-Melt Fixing Posts
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional display devices with frame modules formed by second injection molding technology result in thick frames, making it difficult to reduce the thickness of the frame module.
Innovation Solution
A display device design incorporating a frame module with a back plate, frame, and first fixing post, where the first fixing post includes a connecting and pressing portion that penetrates through a hole in the back plate, allowing the frame to press against the back plate's surfaces, and an adhesive layer bonding the back plate and frame, enabling a thinner structure through the use of hot-melt method and injection molding processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If second injection molding technology is used to combine frame components, then the components are securely combined, but the resulting frame module has large thickness
Solution Approach 1:
The invention divides the frame module into separate components (back plate, frame, and fixing posts) that are assembled together through hot-melt method rather than using a single integrated structure formed by secondary injection molding. This segmentation allows each component to be optimized independently and reduces the overall thickness while maintaining structural integrity.
Solution Approach 2:
The invention replaces the mechanical secondary injection molding process with a hot-melt bonding method. The fixing posts are inserted through holes in the back plate and bonded using hot-melt material, substituting the complex multi-step injection molding process with a simpler assembly process that achieves secure bonding without adding significant thickness.
2Stability of the object's composition
If traditional secondary injection molding is used, then the frame structure is stable, but material usage and weight are high
Solution Approach 1:
By segmenting the frame module into discrete components connected by fixing posts, the design achieves structural stability through precise positioning and targeted bonding areas rather than requiring massive integrated structures. This reduces overall material usage and weight while maintaining compositional stability.
Solution Approach 2:
The hot-melt bonding is applied locally at the fixing post connection points rather than throughout the entire frame structure. This localized bonding approach provides sufficient structural stability at critical joints while minimizing overall material usage and weight compared to traditional secondary injection molding that requires thick material throughout.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves a thinner frame module by fixing the relative position of the back plate and frame using the hot-melt method, reducing material usage and weight while maintaining structural integrity, compared to traditional secondary injection molding techniques.
Implementation Method 1
an adhesive layer bonding the back plate and frame
Implementation Method 2
fixing the relative position of the back plate and frame using the hot-melt method
Data Source
AI summary
A display device includes a frame module, a display panel, a backlight module, a rear case and a control module. The frame module includes a back plate, a frame and a fixing column. The back plate has a first surface and a second surface opposite to the first surface and a hole extending from the first surface to the second surface. The fixing column is protrudingly disposed on the frame and is coupled to the hole. The fixing column includes a pressing portion and a connecting portion connecting the frame and the pressing portion. The connecting portion is disposed in the hole, and the frame presses against the first surface, and the pressing portion presses against the second surface. The backlight module is disposed between the back plate and the display panel. The control module is disposed between the rear case and the frame module.