Display Module Frame Structure for Thermal Seam Control
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Solution Overview
Problem
Display apparatuses face issues with seams forming between display modules due to thermal expansion, which can lead to a decrease in the perceived unity of the screen and an increase in the visibility of gaps, especially when modules with different thermal expansion coefficients are used.
Innovation Solution
A display apparatus design that includes a frame with multiple module attachment layers and frame panels, each with a specific thermal expansion coefficient, and adhesive layers with greater ductility than the modules and frame panels, along with fixing members to restrict relative movement between the modules and frame panels, ensuring consistent gap maintenance during thermal expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If display modules with different thermal expansion coefficients are used, then manufacturing flexibility and material selection are improved, but seam formation and gap visibility increase due to differential thermal expansion
Solution Approach 1:
The patent introduces a frame structure with specific thermal expansion characteristics that acts as an intermediary between display modules with different thermal expansion coefficients. By controlling the frame's thermal expansion parameter, the system accommodates differential expansion while maintaining consistent gaps. The frame's thermal expansion coefficient is specifically selected to balance the expansion of different modules, preventing seam formation.
Solution Approach 2:
The frame serves as a mediator between display modules with different thermal expansion properties. Rather than directly connecting modules with incompatible expansion characteristics, the frame absorbs and distributes the differential expansion forces, maintaining uniform gaps between modules while allowing each module to expand according to its own thermal properties.
2Stability of the object's composition
If rigid fixing structures are used to prevent module movement, then structural stability is improved, but thermal expansion stress increases leading to seam formation
Solution Approach 1:
The patent employs adhesive layers with specific ductility characteristics as flexible intermediaries between the rigid frame and display modules. These adhesive layers provide sufficient bonding to maintain structural stability while accommodating thermal expansion through their ductile deformation, preventing stress concentration and seam formation at the module-frame interfaces.
Solution Approach 2:
The patent carefully selects the ductility parameter of adhesive layers to optimize the balance between structural stability and thermal expansion accommodation. By controlling the adhesive's ductility, the system maintains rigid enough bonding for structural integrity while allowing sufficient flexibility to absorb thermal expansion stresses without generating harmful stresses that cause seams.
3Shape
If gaps between display modules are minimized for visual unity, then screen appearance is improved, but thermal expansion causes seam formation and gap irregularity
Solution Approach 1:
The patent optimizes the initial gap dimension parameter between display modules to achieve visual unity while accounting for thermal expansion. The gap size is specifically designed to be small enough for aesthetic purposes but large enough to accommodate expected thermal expansion without causing seams or irregularities. This parameter optimization balances appearance and reliability.
Solution Approach 2:
The patent explicitly designs the frame and adhesive system to work in conjunction with thermal expansion rather than resist it. The frame's thermal expansion characteristics and the adhesive's ductility are selected to ensure that during temperature variations, the gaps between modules remain consistent and uniform, preventing seam formation while maintaining the visual unity achieved by minimal initial gap spacing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents the increase in seams between display modules due to thermal expansion, maintaining consistent gap lengths and enhancing the visual unity of the screen by synchronizing the thermal expansion of modules and frame components.
Implementation Method 1
a first module attachment layer to which some display modules among the plurality of display modules are attached and having a first thermal expansion coefficient; a first frame panel coupled to the first module attachment layer and having a second thermal expansion coefficient different from the first thermal expansion coefficient
Implementation Method 2
adhesive layers with greater ductility than the modules and frame panels
Implementation Method 3
a first fixing member configured to fix a first portion on the first module attachment layer and a first portion on the first frame panel so that the first portion on the first module attachment layer and the first portion on the first frame panel do not move relative to each other as the first module attachment layer and the first frame panel thermally expand
Data Source
AI summary
A display apparatus may include: a plurality of display modules; and a frame configured to support the plurality of display modules in a matrix arrangement. The frame may include: a first module attachment layer to which some display modules among the plurality of display modules are attached and having a first thermal expansion coefficient; a first frame panel coupled to the first module attachment layer and having a second thermal expansion coefficient different from the first thermal expansion coefficient; and a second module attachment layer to which remaining display modules of the plurality of display modules are attached, having the first thermal expansion coefficient, and disposed adjacently with the first module attachment layer; a second frame panel coupled to the second module attachment layer, having the second thermal expansion coefficient.