Display Module Frame Structure for Thin, Strong Micro LED Panels
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Solution Overview
Problem
Current display technologies, such as liquid crystal panels and OLEDs, face issues like slow response times, high power consumption, and burn-in, while micro LED display panels offer improved brightness, resolution, and durability but require innovative structural solutions for reduced thickness and enhanced strength.
Innovation Solution
A display apparatus featuring a frame with a board receiving portion that accommodates a circuit board, a board bracket with elastic properties, and a reinforcing member, which collectively reduce thickness and enhance structural strength by allowing modular arrangement of inorganic light-emitting display modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a conventional frame structure is used to support display modules, then the structural strength is sufficient, but the thickness of the display apparatus increases
Solution Approach 1:
The board receiving portion is formed by creating a recessed space within the frame panel's thickness dimension rather than adding external protrusions. This allows the circuit board to be accommodated in the thickness direction, reducing the overall apparatus thickness while maintaining frame structural integrity through the recessed design
2Length of moving object
If the frame panel is made thinner to reduce apparatus thickness, then the thickness is reduced, but the structural strength and ability to support display modules decreases
Solution Approach 1:
A board bracket is introduced as a supporting component made of material with higher strength than the frame panel. This composite structure allows the frame panel to be thinner while the board bracket provides the necessary mechanical support for the circuit board, compensating for the reduced frame panel thickness
3Strength
If a board bracket is added to support the circuit board, then the structural strength is improved, but the device complexity increases
Solution Approach 1:
The board receiving portion integrates multiple functions: it supports the circuit board, provides mechanical protection, and manages thermal expansion. By combining these functions into a single recessed structure rather than adding separate components, the design reduces overall complexity while maintaining the necessary support strength
4Device complexity
If the circuit board is directly mounted on the frame panel, then the device complexity is reduced, but the uniformity of thermal expansion management and external force distribution decreases
Solution Approach 1:
The board receiving portion acts as an intermediary between the frame panel and circuit board, providing a dedicated interface that uniformly distributes thermal expansion forces and external loads. This intermediate structure ensures even stress distribution across the circuit board mounting area, preventing localized stress concentrations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a thinner and stronger display apparatus with improved heat dissipation and uniformity, maintaining screen integrity by managing thermal expansion and external forces effectively.
Implementation Method 1
a board bracket with elastic properties
Data Source
AI summary
A display apparatus includes: a plurality of display modules; a frame supporting the plurality of display modules arranged in a matrix, the frame including a board receiving portion on a second surface of the frame opposite to a first surface of the frame facing the plurality of display modules; a board bracket in the board receiving portion and mounted on the frame; and a circuit board in the board receiving portion and mounted on the board bracket, the circuit board being electrically connected to the plurality of display modules.