Display Panel Groove Layout for Overlapping Driver Chip and PCB
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Solution Overview
Problem
Existing display apparatuses face challenges in maximizing the display area by minimizing the non-display area, particularly due to the space occupied by driving chips and printed circuit boards.
Innovation Solution
The display apparatus incorporates a groove in the non-display area to recess the driving chip and printed circuit board, with parallel pads and connection wirings, reducing the non-display area's thickness and overlapping footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the driving chip and printed circuit board are placed on the non-display area, then the display area is reduced, but the functional components are properly positioned
Solution Approach 1:
The patent utilizes the thickness dimension (z-direction) by forming a groove that extends downward from the non-display area. This allows the driving chip and printed circuit board to be positioned at different vertical levels, effectively using three-dimensional space to resolve the two-dimensional area conflict between display and functional components.
Solution Approach 2:
The driving chip is positioned within the groove formed in the non-display area, and the printed circuit board is positioned to overlap the driving chip in plan view. This nested arrangement allows functional components to be contained within the footprint of the non-display area, minimizing the impact on the display area while maintaining proper component positioning.
2Area of moving object
If the non-display area is reduced to increase display area, then the display area increases, but the space for functional components becomes insufficient
Solution Approach 1:
By forming a groove that extends in the thickness direction, the patent creates additional vertical space within the non-display area. This allows functional components to be accommodated in the vertical dimension rather than requiring additional horizontal space, thereby enabling the non-display area to be minimized without compromising component placement capability.
Solution Approach 2:
The patent merges the positioning of the driving chip and printed circuit board within the same non-display area footprint by using overlapping placement in plan view. This combined arrangement maximizes space utilization, allowing both functional components to share the limited non-display area while the display area is expanded.
3Length of stationary object
If the driving chip is recessed in a groove, then the non-display area thickness is reduced, but the manufacturing complexity increases
Solution Approach 1:
The non-display area is segmented into different vertical levels by forming a groove. The driving chip is positioned at a lower level within the groove, while the printed circuit board is positioned at a higher level that overlaps the groove. This segmentation allows the structure to be built in discrete layers, simplifying the manufacturing process compared to creating a completely three-dimensional complex structure.
Solution Approach 2:
The groove acts as an intermediary structure that facilitates the positioning of the driving chip and printed circuit board at different vertical levels. By providing this intermediate recessed space, the groove enables thickness reduction while maintaining a relatively simple manufacturing approach, as the groove can be formed using standard semiconductor fabrication techniques.
Data Source
AI summary
A display apparatus includes a first substrate including a display area and a non-display area at least partially surrounding the display area, and a groove that overlaps the non-display area and is recessed in a thickness direction, pixels located on the first substrate and overlapping the display area, a driving chip located in the groove, and a printed circuit board located in the non-display area and overlapping the driving chip in a plan view.