Display Device Ground Member EMI Removal
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Solution Overview
Problem
Display devices experience image quality degradation due to electromagnetic interference (EMI) caused by electrical floating areas between non-conductive layers and printed circuit boards, leading to signal distortion.
Innovation Solution
A display device design that electrically connects a non-conductive material layer between the substrate and printed circuit board through a ground member, eliminating the need for conductive tape and preventing EMI by routing it to the printed circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a non-conductive layer is added between the substrate and the printed circuit board, then insulation is improved, but an electrical floating area occurs causing EMI and signal distortion
Solution Approach 1:
The ground member acts as an intermediary element that bridges the non-conductive layer between the substrate and printed circuit board. It provides a conductive path through the non-conductive layer to connect the substrate to ground, eliminating the electrical floating area and EMI while preserving the insulation benefits of the non-conductive layer.
Solution Approach 2:
The ground member is divided into multiple segments including a first ground electrode on the substrate, a second ground electrode on the printed circuit board, and intermediate conductive structures. These segmented ground elements work together to establish continuous grounding through the non-conductive layer without compromising insulation elsewhere.
2Object-generated harmful factors
If conductive tape is used to connect the substrate to the printed circuit board, then EMI is eliminated, but device complexity and installation space increase
Solution Approach 1:
The ground member integrates multiple grounding functions into a single unified structure that combines elements previously requiring separate conductive tape connections. The merged structure includes ground electrodes, conductive patterns, and intermediate connection elements that work together as one integrated grounding solution, reducing overall device complexity.
Solution Approach 2:
The ground member serves multiple functions simultaneously: it provides electrical grounding, establishes reference potential, eliminates EMI, and maintains mechanical alignment between substrate and printed circuit board. This multi-functionality replaces what previously required separate components including conductive tape.
3Reliability
If conductive tape is used to eliminate EMI, then signal quality is improved, but installation space and component count increase
Solution Approach 1:
The grounding connection is transitioned from a planar two-dimensional tape connection to a three-dimensional vertical structure that passes through the non-conductive layer. The ground member extends in the thickness direction, establishing electrical connection through the insulation layer without requiring additional lateral installation space.
Solution Approach 2:
The ground member is nested within the existing device structure, with ground electrodes positioned on the substrate and printed circuit board surfaces, and intermediate conductive structures embedded within or adjacent to the non-conductive layer. This nesting approach eliminates the need for separate conductive tape components.
Data Source
AI summary
Embodiments of the disclosure relate to a display device and, more specifically, may provide a display device capable of removing EMI formed in an electrical floating area by comprising a substrate including a display area and a non-display area, a pad area disposed in the non-display area, a printed circuit board electrically connected to the pad area, an encapsulation layer formed of a metal material and disposed on the substrate, a protection layer formed of a non-metallic material and disposed on the encapsulation layer, a heat dissipation plate disposed on the protection layer, and a ground member positioned on the substrate and connected between the pad area and the encapsulation layer.