Display Panel Heat Blocking Layout for Adhesive Layer Stability
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Solution Overview
Problem
The deformation of the adhesive layer due to heat and pressure during the attachment of the driving IC chip to the display panel causes poor appearance and visibility issues in subsequent processes.
Innovation Solution
Incorporating a heat blocking part spaced apart from the short side of the driving IC chip by a predetermined distance and having a specific width, which prevents the transmission of radiant heat and pressure to the adhesive layer, thereby maintaining its integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heat and pressure are applied to attach the driving IC chip to the display panel, then the IC chip is securely fixed, but the adhesive layer deforms causing poor appearance and visibility
Solution Approach 1:
The solution divides the bonding tool into multiple heating zones with different temperature characteristics. The first heating zone applies higher temperature for reliable IC chip attachment, while the second heating zone uses lower temperature to prevent adhesive layer deformation, thus resolving the contradiction between attachment reliability and adhesive layer integrity
Solution Approach 2:
Different regions of the bonding tool are designed with different thermal properties - the first heating zone has higher temperature for secure bonding, while the second heating zone has lower temperature to protect the adhesive layer. This local differentiation allows simultaneous achievement of reliable attachment and adhesive layer preservation
2Ease of manufacture
If a conventional bonding tool is used to attach the IC chip, then the attachment process is simple, but radiant heat deforms the adhesive layer
Solution Approach 1:
The bonding tool is segmented into two distinct heating zones: the first heating zone for IC chip attachment and the second heating zone for preventing adhesive layer deformation. This segmentation maintains ease of manufacture while eliminating the harmful radiant heat effect on the adhesive layer
Solution Approach 2:
The second heating zone acts as an intermediary thermal barrier that controls the distribution of radiant heat, allowing the first heating zone to perform attachment while the second zone prevents excessive heat from deforming the adhesive layer
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents deformation of the adhesive layer, ensuring the display device maintains its appearance and visibility during the IC chip attachment process.
Implementation Method 1
a heat blocking part disposed in the peripheral area and spaced apart from the short side of the driving IC chip by a predetermined distance in a direction parallel to the long side
Data Source
AI summary
A display device includes a display panel including a display area and a peripheral area, a protective film attached to a lower surface of the display panel, an adhesive layer disposed between the display panel and the protective film, a driving integrated circuit (“IC”) chip disposed in the peripheral area and including a long side and a short side, and a heat blocking part disposed in the peripheral area, and spaced apart from the short side of the driving IC chip by a predetermined distance in a direction parallel to the long side.