Bendable Display Module Heat Conduction Assembly for Chip Hotspots
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Solution Overview
Problem
Existing display modules face challenges in efficiently dissipating heat generated by driving chips, particularly in full-screen and large-screen electronic devices, which can lead to burn damage and reduced durability due to concentrated heat.
Innovation Solution
A display module design incorporating a heat dissipation layer and a heat conduction assembly with a supporting structure, where the heat conduction assembly is smaller than the heat dissipation layer, and a driving chip is positioned to overlap with the heat conduction assembly, allowing for efficient heat transfer and support between panel parts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat dissipation layer is added to dissipate heat from the driving chip, then heat dissipation performance is improved, but device structure becomes more complex
Solution Approach 1:
The heat conduction assembly integrates multiple functions: it serves as both a heat conduction path and a supporting structure for the display panel. The assembly combines the heat conduction layer, supporting structure, and buffering structure into a single integrated component, reducing the number of separate parts while maintaining effective heat dissipation from the driving chip.
Solution Approach 2:
The heat conduction assembly performs multiple functions simultaneously: heat conduction from the driving chip, structural support for the display panel, and buffering during panel bending. This multi-functional design improves heat dissipation performance without proportionally increasing device complexity.
2Adaptability or versatility
If the display panel is made flexible to enable bending, then adaptability is improved, but structural integrity deteriorates
Solution Approach 1:
The heat conduction assembly includes a buffering structure designed to absorb and distribute stress before it can damage the display panel during bending. This pre-engineered cushioning protection allows the panel to be flexible while maintaining structural integrity by preventing stress concentration at critical points.
Solution Approach 2:
The heat conduction assembly uses a thin-film structure that can flex with the display panel while maintaining its heat conduction and support functions. The flexible design of the assembly allows it to accommodate panel bending without compromising the overall structural integrity.
3Manufacturing precision
If the heat conduction assembly area is reduced to improve manufacturing precision, then manufacturing precision is improved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The heat conduction assembly uses a smaller area design with concentrated heat conduction paths directly under the driving chip. This local quality approach focuses heat dissipation where it is most needed (under the heat-generating component) rather than distributing it uniformly, maintaining effective heat dissipation while reducing overall assembly area for improved manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively dissipates heat generated by the driving chip, preventing burn damage and enabling the display panel to be bent without compromising structural integrity, thus enhancing the durability and performance of full-screen and large-screen devices.
Implementation Method 1
a heat conduction assembly, disposed between the heat dissipation layer and the second part, and fixedly connected to the heat dissipation layer and the second part
Implementation Method 2
a heat dissipation layer, disposed on a side, proximal to the second part, of the first part, and fixedly connected to the first part
Data Source
AI summary
Disclosed are a display module and a method for manufacturing the same, and a display device. The display module includes: a display panel, a heat dissipation layer, a heat conduction assembly, and a driving chip, wherein the display panel includes a first part and a second part opposite to each other, and a bending part connecting the first part and the second part; the heat dissipation layer is disposed on a side, proximal to the second part, of the first part; the heat conduction assembly is disposed between the heat dissipation layer and the second part; an area of an orthographic projection of the heat conduction assembly on the first part is smaller than an area of an orthographic projection of the heat dissipation layer on the first part; and the driving chip is disposed on a side, distal from the heat conduction assembly, of the second part distal.