Dual-Layer Display Heat Dissipation for Thin Flexible Panels

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Solution Overview

Problem

High-performance and miniaturized display devices generate significant heat, which can shorten their lifespan and cause component failure, and existing heat dissipation methods are inadequate.

Innovation Solution

A display device design incorporating a dual-layer heat dissipation system using polymer resin and nano-particle composites, with varying nano-particle concentrations and thicknesses to enhance heat dissipation and impact resistance, allowing for flexible and efficient heat management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a single heat dissipation layer is used, then the device structure is simple, but the heat dissipation performance is insufficient

Engineering Contradiction:
Improveheat dissipation performanceVSAvoidheat dissipation structure
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The heat dissipation system is divided into two separate layers: a first heat dissipation layer with first nanoparticles and a second heat dissipation layer with second nanoparticles. Each layer has different thickness and nanoparticle concentration, allowing optimized heat dissipation at different depths while managing device complexity through modular design.

Inventive Principle:
Principle #1Segmentation

2Temperature

If uniform nanoparticle concentration is used throughout the heat dissipation layer, then the manufacturing process is simple, but the heat dissipation efficiency is reduced

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidnanoparticle distribution
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The first heat dissipation layer has a first nanoparticle concentration and the second heat dissipation layer has a second nanoparticle concentration, with the first concentration being different from the second concentration. This local variation in nanoparticle distribution optimizes heat dissipation efficiency at different depths of the device.

Inventive Principle:
Principle #3Local quality

3Temperature

If thicker heat dissipation layer is used, then the heat dissipation performance is improved, but the device thickness increases

Engineering Contradiction:
Improveheat dissipation performanceVSAvoiddevice thickness
Core Design Contradiction:
TemperatureVSLength of moving object

Solution Approach 1:

The patent optimizes the thickness of each heat dissipation layer and the concentration of nanoparticles to achieve effective heat dissipation while minimizing overall device thickness. By adjusting these parameters, the system balances heat dissipation performance with compact device design.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The dual-layer heat dissipation system effectively reduces device thickness while improving heat dissipation performance and reliability, enabling flexible devices with enhanced impact resistance.

Implementation Method 1

a first heat dissipation member and a second heat dissipation member different from the first heat dissipation member disposed under the display panel

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

A display device design incorporating a dual-layer heat dissipation system using polymer resin and nano-particle composites

Methodology Applied
Scientific EffectThermal energy absorption: Absorption (physical)

Data Source

PatentEP4212987B1Display device and method for manufacturing the same
Publication Date: 2026.03.18 SAMSUNG DISPLAY CO LTD
  • EP4212987B1 patent drawingFigure 1
  • EP4212987B1 patent drawingFigure 2A
  • EP4212987B1 patent drawingFigure 2B

AI summary

A display device includes a display panel including a base layer, a first heat dissipation member disposed on a first surface of the base layer, and a second heat dissipation member disposed on a first surface of the first heat dissipation member. The first heat dissipation member includes a first polymer resin and first heat dissipation nano-particles dispersed in the first polymer resin, and the second heat dissipation member includes a second polymer resin and second heat dissipation nano-particles dispersed in the second polymer resin. The weight of the first heat dissipation nano-particles in the first heat dissipation member may be different from the weight of the second heat dissipation nano-particles in the second heat dissipation member.