Display Heat Dissipation Substrate Outermost Integration
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Solution Overview
Problem
Organic light emitting display apparatuses face challenges in achieving a balance between heat dissipation, weight, thickness, and structural integrity, leading to reduced performance and consumer demand for optimized displays.
Innovation Solution
A display apparatus design featuring a substrate with a light emitting device, adhesive layers, a heat dissipation substrate, and a circuit film connected to a printed circuit board, where the heat dissipation substrate is positioned at the outermost portion to enhance heat dissipation and structural balance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If additional components (inner plate, back cover) are added for heat dissipation and rigidity, then heat dissipation performance and structural integrity are improved, but weight and thickness increase
Solution Approach 1:
The patent merges the heat dissipation function with the back cover structure by forming a heat dissipation groove directly in the back cover, eliminating the need for separate inner plates and additional heat dissipation components. This integration maintains heat dissipation performance while reducing overall weight and structural complexity
Solution Approach 2:
The back cover is designed to serve multiple functions simultaneously: it provides structural support, enables heat dissipation through integrated grooves, and maintains device rigidity. This multi-functionality eliminates the need for separate dedicated heat dissipation components
2Temperature
If additional components (inner plate, back cover) are added for heat dissipation and rigidity, then heat dissipation performance and structural integrity are improved, but thickness increases
Solution Approach 1:
The heat dissipation function is merged into the back cover structure through integrated grooves, eliminating the need for separate inner plates and additional thickness-consuming components. This integration maintains heat dissipation capability while minimizing thickness increase
Solution Approach 2:
Instead of adding thickness by stacking more components, the patent addresses heat dissipation by creating grooves that extend laterally in the back cover structure. This dimensional approach to heat dissipation avoids increasing the device thickness while maintaining effective heat transfer pathways
3Temperature
If additional components are added for heat dissipation, then heat dissipation performance is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple functions (structural support, heat dissipation, rigidity maintenance) into a single back cover component with integrated grooves, eliminating the need for separate inner plates and additional heat dissipation components. This reduces the number of parts and simplifies assembly while maintaining heat dissipation performance
Solution Approach 2:
The back cover is designed as a multi-functional component that simultaneously provides structural support, enables heat dissipation through integrated grooves, and maintains device rigidity. This multi-functionality eliminates the need for separate dedicated heat dissipation components, reducing overall device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively improves heat dissipation and structural integrity while maintaining a slim and lightweight design, addressing the limitations of existing organic light emitting display apparatuses.
Implementation Method 1
a heat dissipation substrate provided on the adhesive layer
Data Source
AI summary
A display apparatus having enhanced heat dissipation performance is provided. The display apparatus includes a substrate including a display area with a light emitting device disposed therein and a non-display area surrounding the display area, an adhesive layer covering the light emitting device, a heat dissipation substrate provided on the adhesive layer, a pad part provided in the non-display area of the substrate, a circuit film electrically connected to the pad part, and a printed circuit board disposed on the heat dissipation substrate and electrically connected to the circuit film, wherein the heat dissipation substrate is disposed in the outermost portion of the display apparatus.