Display Device Heat Exchange Module With Integral Airflow Holes
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Solution Overview
Problem
Existing display devices with fan-based heat dissipation solutions have limited heat dissipation effectiveness for high-power components, and existing heat dissipation fins can hinder airflow and accumulate pollutants, leading to inefficient heat conduction and potential damage from high temperatures.
Innovation Solution
A display device with a heat exchange module featuring integral first and second heat exchange holes, where a circulation airflow inside the sealed space flows through the first holes and outside air flows through the second holes, enabling heat exchange between the two airflows to efficiently lower the temperature, with additional features like a heat exchange plate and splicing heat exchange units for enhanced performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation fins are arranged on the casing to perform heat exchange, then heat dissipation effect is improved for general display functions, but heat dissipation capability is insufficient for high-power component expansion
Solution Approach 1:
The heat exchange module is divided into multiple independent heat exchange units that can be spliced together in series. Each unit contains heat exchange holes and can be independently configured, allowing the overall heat exchange capacity to be scaled by adding more units rather than redesigning the entire system.
Solution Approach 2:
The patent transitions from traditional fin-based heat exchange to a volumetric heat exchange approach using multiple heat exchange holes arranged in series. This creates additional heat exchange dimensions and pathways, significantly increasing the heat exchange area and efficiency without proportionally increasing the device footprint.
2Temperature
If multiple baffles (fins) are formed transversely in the space to dissipate heat, then heat dissipation is provided, but the baffles disturb airflow and accumulate pollutants that hinder heat conduction
Solution Approach 1:
The patent removes the traditional baffle/fan structure from the heat exchange path and replaces it with a streamlined heat exchange module that allows smooth airflow through heat exchange holes. This extraction eliminates the airflow disturbance and pollutant accumulation problems associated with transverse baffles.
Solution Approach 2:
The heat exchange module acts as an intermediary structure between the sealed and unsealed spaces, providing heat exchange functionality through controlled holes rather than through direct baffle interaction with the airflow. This intermediary approach maintains heat exchange efficiency while preserving smooth airflow.
3Temperature
If an air conditioner is used for heat dissipation, then heat dissipation effect is improved, but device size, noise, power consumption and environmental impact increase
Solution Approach 1:
The heat exchange module utilizes the device's own operational environment and existing airflow patterns to achieve heat dissipation. By positioning the module to exploit natural convection and existing air circulation, the system achieves effective cooling without requiring additional active cooling devices like air conditioners.
Solution Approach 2:
The patent changes the heat dissipation approach from active mechanical cooling (air conditioner) to passive thermal exchange through optimized hole geometry and arrangement. By carefully designing the heat exchange holes' size, shape, and distribution, the system achieves efficient heat transfer through natural thermal gradients and convection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly improves heat exchange efficiency, achieving fast temperature lowering and effective heat dissipation for high-power components, preventing damage from high temperatures and maintaining a clean environment within the display device.
Implementation Method 1
the second circulation airflow performs heat exchange on the first circulation airflow through the first heat exchange holes and the second heat exchange holes
Implementation Method 2
a first circulation airflow is formed in the sealed space... a second circulation airflow formed by outside air flows through the second heat exchange holes
Data Source
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AI summary
The present invention relates to a display device with a heat exchange module and a heat exchange method thereof. The display device comprises a casing, a display unit and a heat exchange module, wherein a sealed space is formed inside the casing; the display unit is arranged in the sealed space; and the heat exchange module is arranged on the casing. The heat exchange module is provided with first heat exchange holes positioned inside the sealed space and second heat exchange holes positioned outside the sealed space; a first circulation airflow is formed between the first heat exchange holes and the sealed space; and the second heat exchange holes communicate with outside to form a second circulation airflow for performing heat exchange with the first circulation airflow. The present invention realizes heat exchange on the first circulation airflow by the second circulation airflow by using the second heat exchange holes and the first heat exchange holes formed in the heat exchange module of an integral structure. Compared with an existing heat dissipation fin, the present invention can improve the heat exchange efficiency to achieve a fast temperature lowering effect, so that a good heat dissipation effect is achieved on the display unit.