Display Heat Dissipation Layer With Graded Conductive Particles
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Solution Overview
Problem
As electronic apparatuses become thinner and more integrated, they generate significant heat, which can reduce product lifespan and cause failures and malfunctions.
Innovation Solution
An electronic apparatus with a heat dissipation layer on its rear surface, featuring a base portion with conductive particles dispersed to increase conductivity, and a flexible circuit board and electronic module under the heat dissipation layer, enhancing heat dissipation and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the electronic apparatus performance and thinness are increased, then the integration capacity is improved, but heat generation increases causing component failures
Solution Approach 1:
The heat dissipation layer employs non-uniform distribution of conductive particles, with higher density at the lower portion (spaced apart from display panel) and lower density at the upper portion (contacting display panel). This local variation in conductivity optimizes heat dissipation efficiency while maintaining thinness, resolving the contradiction between performance/thinness and component reliability.
Solution Approach 2:
The heat dissipation layer is constructed as a composite material combining polymer resin base portion with dispersed conductive particles. This composite structure enables simultaneous achievement of thinness, heat dissipation functionality, and electrical conductivity, addressing the contradiction between improved performance/thinness and component lifespan.
2Temperature
If conventional heat dissipation layers are used, then heat dissipation is provided, but additional shielding functions require separate layers increasing thickness
Solution Approach 1:
The heat dissipation layer is designed to perform multiple functions simultaneously: heat dissipation through conductive particles, electromagnetic wave shielding through the same conductive particles, and light blocking. This multi-functionality eliminates the need for separate shielding layers, reducing overall thickness while maintaining heat dissipation performance.
Solution Approach 2:
The patent merges heat dissipation functionality with electromagnetic wave shielding and light blocking functions into a single integrated layer. The conductive particles serve dual purposes: dissipating heat and providing electromagnetic shielding, thereby reducing the number of layers and overall thickness.
3Ease of manufacture
If conductive particles are uniformly dispersed, then manufacturing is simple, but heat dissipation efficiency is reduced
Solution Approach 1:
The patent implements non-uniform distribution of conductive particles within the heat dissipation layer, concentrating particles in the lower portion (spaced apart from display panel) where heat dissipation is most critical. This local quality variation enhances heat dissipation efficiency while remaining manufacturable through controlled particle dispersion techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat dissipation layer effectively dissipates heat, protecting the display panel and electronic components while maintaining a thin profile, improving reliability and reducing the risk of failures.
Implementation Method 1
Conductive particles are dispersed in the base portion... The conductivity of the heat dissipation layer on the second surface may be greater than a conductivity of the heat dissipation layer on the first surface
Implementation Method 2
A magnetic field is applied to the preliminary heat dissipation layer
Data Source
AI summary
An electronic apparatus include a display panel having a rear surface. A heat dissipation layer is disposed on the rear surface of the display panel. The heat dissipation layer includes a base portion including a first surface facing the rear surface and a second surface opposite to the first surface. Conductive particles are dispersed in the base portion. The conductive particles may be spaced apart from the first surface. A density of a distribution of the conductive particles increases from the first surface to the second surface.