Display Panel Heat Dissipation Layout for Uniform LED Temperature

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Solution Overview

Problem

Display apparatuses using light emitting diodes (LEDs) face heat generation issues, leading to temperature deviations and visible spots or color differences due to uneven heat distribution, which affect display quality.

Innovation Solution

Incorporating a heat dissipation member with a first portion overlapping the printed circuit board and a second portion spaced apart, designed to diffuse heat generated from the printed circuit board throughout the display panel, thereby minimizing temperature deviations and improving heat distribution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a heat dissipation member is added to solve heat generation problems, then temperature deviation is reduced, but device complexity increases

Engineering Contradiction:
Improvetemperature deviationVSAvoiddevice complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The heat dissipation member extends in the thickness direction of the display panel, utilizing the Z-dimension to conduct heat away from the light emitting elements. This vertical heat dissipation path resolves the temperature issue without complicating the planar structure of the display panel.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The heat dissipation member acts as an intermediary component between the light emitting elements and the external environment, conducting heat from the high-temperature LED chips to lower-temperature regions. This mediator approach effectively reduces temperature deviation while maintaining a clear functional separation.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of manufacture

If heat is concentrated in a specific area, then manufacturing is simpler, but display quality deteriorates due to visible spots and color differences

Engineering Contradiction:
Improveheat distribution uniformityVSAvoiddisplay quality
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The heat dissipation member provides localized heat dissipation exactly where needed - at the light emitting elements that generate the most heat. This targeted approach prevents hot spots and color differences in the display while maintaining simple manufacturing processes.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces temperature deviations and prevents heat concentration, enhancing display quality by minimizing visible spots and color differences, resulting in a more uniform and stable temperature distribution across the display panel.

Implementation Method 1

a heat dissipation member disposed on one side of the display panel... designed to diffuse heat generated from the printed circuit board throughout the display panel

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS20240332477A1Display apparatus
Publication Date: 2024.10.03 LG DISPLAY CO LTD
  • US20240332477A1 patent drawing
  • US20240332477A1 patent drawing
  • US20240332477A1 patent drawing

AI summary

The present disclosure relates to a display apparatus. A display apparatus according to an embodiment of the present disclosure includes a display panel configured to display images, a heat dissipation member disposed on one side of the display panel, and a printed circuit board disposed on one side of the heat dissipation member. The heat dissipation member includes a first portion overlapping the printed circuit board, and a second portion disposed in an area spaced apart from the printed circuit board at a certain interval.