Display Hinge Assembly for Up-Down Motion and Heat Dissipation

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Solution Overview

Problem

Existing electronic devices with large screen displays face challenges in providing an immersive user experience due to limitations in hinge mechanisms that restrict up-down movement and efficient heat dissipation, leading to potential deformation and image quality issues.

Innovation Solution

A hinge structure for electronic devices featuring a hinge assembly with a cylindrical hinge shaft, first and second coupling parts, a cam, and a foot plate, which allows up-down pivoting and effective heat dissipation through a plate made of aluminum and a module cover with a forming area for heat dissipation, ensuring image quality and user interaction.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a traditional hinge mechanism is used to support a large screen display, then the device structure is simple, but the up-down movement capability is restricted and heat dissipation is insufficient

Engineering Contradiction:
Improveup-down movement capabilityVSAvoidhinge mechanism complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The hinge mechanism is divided into multiple functional components: a hinge assembly with rotating and non-rotating parts, a separate cam mechanism, and an independent support member. This segmentation allows each component to perform its specific function (rotation, cam action, support) independently, enabling up-down movement capability while maintaining manageable overall complexity through modular design

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The hinge mechanism transitions from a static structure to a dynamic one by introducing rotational capability to the hinge assembly and cam-driven motion to the support member. The hinge assembly can rotate relative to the device body, and the cam mechanism converts rotational motion into linear up-down movement of the support member, providing adaptability for different display angles and positions

Inventive Principle:
Principle #15Dynamics

2Temperature

If a traditional hinge mechanism is used, then the manufacturing process is simple, but heat dissipation capability is insufficient leading to deformation and image quality issues

Engineering Contradiction:
Improveheat dissipation capabilityVSAvoidmanufacturing complexity
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The hinge assembly is merged with the heat dissipation function by integrating it with the device's thermal management system. The hinge structure serves dual purposes: providing mechanical support and enabling up-down movement while simultaneously acting as a heat dissipation pathway, thereby improving temperature management without significantly increasing manufacturing complexity

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The hinge assembly acts as an intermediary component between the display module and the device body, facilitating both mechanical movement and thermal transfer. This intermediary structure enables heat to be conducted from the display area through the hinge mechanism to the device chassis, improving heat dissipation capability while maintaining ease of manufacture through a straightforward integration approach

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed hinge structure enhances the immersive screen experience by enabling up-down movement and effective heat management, preventing deformation and maintaining image quality, while providing a robust and flexible display solution for electronic devices with large screens.

Implementation Method 1

effective heat dissipation through a plate made of aluminum

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP4016242B1Electronic device
Publication Date: 2024.09.11 LG ELECTRONICS INC
  • EP4016242B1 patent drawingFigure 1
  • EP4016242B1 patent drawingFigure 2
  • EP4016242B1 patent drawingFigure 3

AI summary

An electronic device is disclosed. The electronic device may include: a body provided with a computing system; a hinge assembly adjacent to one side of the body and installed inside of the body; and a display part including a display panel for displaying a screen, wherein the display part is pivotable with respect to the body and is connected to the hinge assembly, wherein the hinge assembly may include: a hinge shaft; a first coupling part adjacent to one end of the hinge shaft, extended from an outer circumferential surface of the hinge shaft, and fixed to the display part; a second coupling part rotatably coupled to the hinge shaft and fixed to the body; and a foot plate pivotably coupled to the second coupling part and pivotable with the second coupling part according to the rotation of the hinge shaft.