Display Panel Hole Cutting with Two-Stage Laser Ablation
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Solution Overview
Problem
Existing display devices face challenges in accurately defining holes for functional elements and suffer from potential damage during the manufacturing process.
Innovation Solution
A method involving the use of intense light, such as laser cutting, is employed to define precise holes in a display device by irradiating a first intense light and a second intense light with greater power to cut through various layers of the display panel, including a light blocking layer and adhesives, ensuring accurate hole definition and minimizing damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional cutting methods are used to define holes in the display panel, then the manufacturing process is simpler, but the hole definition accuracy is insufficient and damage to the display device occurs
Solution Approach 1:
The patent divides the cutting process into two distinct stages: a preliminary cutting stage that creates initial openings through the display panel, and a final cutting stage that completes the hole definition. This segmentation allows each stage to be optimized independently, with the first stage focusing on creating access points and the second stage focusing on precise hole definition, thereby improving overall manufacturing precision without requiring a single complex cutting process
Solution Approach 2:
The patent employs preliminary cutting to create initial openings through the display panel before performing the final hole definition. This preliminary action removes the bulk of the material and creates access points, reducing the complexity of the final cutting operation and enabling more precise hole definition in the second stage
2Productivity
If higher power intense light is used to cut through all layers, then the cutting speed increases, but damage to the display device increases
Solution Approach 1:
The patent segments the cutting process into two stages with different power levels: the first cutting stage uses lower power to create initial openings with minimal damage, while the second cutting stage uses higher power to complete the hole definition. This segmentation allows the system to achieve high productivity in the second stage without causing damage in the first stage, as each stage is optimized for its specific requirements
Solution Approach 2:
The patent employs periodic action by alternating between two cutting stages with different power levels. The first stage uses lower power for preliminary cutting, and the second stage uses higher power for final cutting. This periodic variation in power application allows the system to maintain high cutting speed while minimizing damage, as the lower power stage prevents excessive heat accumulation that would cause damage
3Reliability
If a single cutting process is used for all layers, then the manufacturing process is simpler, but the ability to define precise holes while minimizing damage is reduced
Solution Approach 1:
The patent divides the cutting process into two distinct stages: a first cutting process that creates initial openings through the display panel using lower power, and a second cutting process that completes the hole definition using higher power. This segmentation enables the system to maintain the integrity of the display device by avoiding excessive heat accumulation in a single process, while the two-stage approach manages the complexity through systematic progression
4Manufacturing precision
If the first adhesive layer is cut before the light blocking layer, then the hole definition is more accurate, but the manufacturing process becomes more complex
Solution Approach 1:
The patent segments the cutting process into two stages where the first stage cuts through the light blocking layer and creates initial openings, while the second stage cuts through the adhesive layers to complete the hole definition. This segmentation allows the system to achieve accurate hole definition by systematically removing layers in a controlled sequence, with each stage optimized for cutting specific materials
Solution Approach 2:
The patent employs preliminary cutting to create initial openings through the light blocking layer before cutting the adhesive layers. This preliminary action establishes the basic hole structure and guides the subsequent cutting of adhesive layers, ensuring accurate hole definition while managing the complexity through a systematic approach
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for more accurate hole definition and reduces damage to the display device during manufacturing, enhancing the precision and integrity of the final product.
Implementation Method 1
irradiating a first intense light from a side of the first protective film toward the cutoff line to cut portions of the first protective film, the display panel, and the polarizing film, which overlap the cutoff area
Implementation Method 2
irradiating a second intense light from a side of the first protective film toward the cutoff line to cut portions of the first adhesive, the deco film, and the second protective film, which overlap the cutoff area
Data Source
AI summary
A display device includes a display panel including a display area including a light blocking area and a non-display area around the display area, a base film disposed on the display panel, a light blocking layer that overlaps the light blocking area and is disposed on a surface of the base film, a first adhesive disposed between the display panel and the base film, a window disposed on the base film, and a second adhesive disposed between the window and the base film. A first hole defined in a portion of the light blocking area passes through the base film, the light blocking layer, the first adhesive, and the second adhesive.