Display Module Hole Wiring for Crack Detection Around Module Holes
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Solution Overview
Problem
Existing electronic devices lack effective methods to detect cracks that may occur in layers around hole areas, which can compromise their reliability and functionality.
Innovation Solution
Incorporating crack detection wiring around the hole area, which includes a hole wiring spaced apart from conductive patterns and connected to detection wirings on different layers, allowing for crack detection during the formation of module holes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If crack detection wiring is added around the hole area, then reliability is improved through crack detection capability, but device complexity increases due to additional wiring structures
Solution Approach 1:
The crack detection wiring is integrated with the existing conductive patterns and detection wirings of the display module, allowing the same wiring structure to serve both functional electrical purposes and crack detection purposes. The hole wiring in the hole area and detection wirings in the peripheral area work together as part of the overall device functionality while providing crack detection capability.
Solution Approach 2:
The crack detection wiring is nested within the existing multi-layer structure of the display module. The hole wiring is disposed in the hole area surrounded by active area, while detection wirings extend to the peripheral area, creating a nested configuration that integrates crack detection functionality within the existing device architecture without adding external structures.
2Measurement precision
If hole wiring is disposed in the hole area surrounded by active area, then crack detection precision is improved, but manufacturing precision requirements increase due to spacing constraints
Solution Approach 1:
The hole wiring is specifically disposed in the hole area with a width greater than zero, creating a localized detection zone where crack detection precision is most needed. The detection wirings are disposed in the peripheral area adjacent to the active area, providing localized detection coverage where cracks are most likely to occur around the hole area.
Solution Approach 2:
The crack detection wiring structure is formed during the manufacturing process before the device is put into service. The hole wiring and detection wirings are disposed in their respective areas with predetermined spacing relationships, establishing the crack detection capability in advance so that cracks can be detected as early as possible during device operation or testing.
3Reliability
If detection wirings extend from hole area to peripheral area, then crack detection coverage is improved, but device complexity increases due to multi-layer wiring arrangement
Solution Approach 1:
The crack detection wiring is segmented into two parts: hole wiring disposed in the hole area and detection wirings disposed in the peripheral area. This segmentation allows each portion to be optimized for its specific function while together providing comprehensive crack detection coverage. The separation of detection wiring from conductive patterns further segments the functional zones within the device.
Solution Approach 2:
The detection wirings are disposed on different layers with detection insulating layer interposed between them, utilizing the vertical dimension to reduce spatial interference and simplify the overall wiring arrangement. This multi-layer configuration allows detection wirings to extend from the hole area to the peripheral area with adequate spacing, improving crack detection coverage while managing complexity through vertical separation.
Data Source
AI summary
An electronic device including: a display module including a front surface and a rear surface opposite the front surface and including a module hole that penetrates from the front surface to the rear surface; and an electronic module overlapping the module hole. The display module includes a crack detection wiring including a hole wiring disposed in a hole area, and a first detection wiring and a second detection wiring of the crack detection wiring are connected to the hole wiring and disposed on different layers with a detection insulating layer interposed therebetween.