Display IC Layout With Heat-Dissipating Molding for Narrow Bezels
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Display devices face challenges in reducing the non-display area and mitigating heat-induced damage to the organic light-emitting layer from driving circuits.
Innovation Solution
The display device incorporates an integrated circuit bonded to a non-overlapping region of the display panel, a circuit board connected to this region, and a molding member with heat dissipation characteristics, along with a flexible printed circuit board extending in various directions to manage heat and reduce the non-display area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the driving circuit is placed on the display panel to reduce the non-display area, then the area of the non-display area is reduced, but the heat generated by the driving circuit damages the organic light-emitting layer
Solution Approach 1:
The display device is divided into distinct functional zones: a display area containing pixels and a non-display area containing the driving circuit. This spatial segmentation allows the driving circuit to be positioned away from the organic light-emitting layer, preventing heat damage while maintaining a compact overall structure.
Solution Approach 2:
A first pad portion is introduced as an intermediary connection element between the display panel and the driving circuit. This pad portion enables electrical connection while allowing spatial separation, so the driving circuit can be positioned in the non-display area without directly contacting the display area, thus reducing heat transfer to the organic light-emitting layer.
2Object-affected harmful factors
If the driving circuit is positioned away from the display area to prevent heat damage, then the organic light-emitting layer is protected, but the non-display area increases
Solution Approach 1:
The driving circuit and the display panel are merged into a single integrated structure where the driving circuit is positioned in the non-display area adjacent to the display area. This merging approach allows close proximity for heat protection while maintaining functional integration, reducing the overall device footprint.
Solution Approach 2:
The driving circuit is positioned in a different spatial zone (non-display area) rather than overlaying or adjacent to the display area in the same plane. This dimensional repositioning allows the driving circuit to be separated from the heat-sensitive organic light-emitting layer while minimizing the increase in non-display area through efficient spatial utilization.
3Area of stationary object
If the non-display area is reduced by forming lines on the side surface of the substrate, then the area of the non-display area is reduced, but the structure becomes more complex
Solution Approach 1:
The driving circuit is extracted from the display area and positioned in a separate non-display area. This extraction simplifies the overall structure by avoiding the need for complex side-surface line formations, while still achieving area reduction through the strategic placement of the driving circuit in the non-display area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the non-display area and prevents or minimizes heat damage to the organic light-emitting layer, enhancing the display device's performance and longevity.
Implementation Method 1
a molding member covering the integrated circuit and a portion of the display panel to which the integrated circuit is bonded
Data Source
AI summary
A display device includes: a display panel on which a display element layer comprising a light-emitting element is located; an integrated circuit (IC) bonded to a first pad portion of the display panel, and comprising a non-overlapping region that does not overlap the display panel; a circuit board bonded to the non-overlapping region of the integrated circuit; and a molding member covering the integrated circuit and a portion of the display panel to which the integrated circuit is bonded.