Display IC Mounting Substrate Segmentation for Bending Reliability
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Solution Overview
Problem
Liquid crystal driving ICs mounted on plastic substrates via face-down bonding are prone to breaking and coming off due to low adhesion strength, limiting bending deformation and flexibility in liquid crystal display panels.
Innovation Solution
A display device configuration featuring an IC mounting substrate along the side edge of a display substrate with a substrate connecting part of shorter length, allowing independent deformation and preventing the IC from breaking or coming off, either through integral formation or separate substrates with matching linear expansion coefficients.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the display substrate is made flexible to enable bending deformation, then the flexibility and adaptability of the display device is improved, but the adhesion strength between the IC mounting substrate and display substrate deteriorates, causing the IC to break or come off
Solution Approach 1:
The substrate connecting part is divided into a first part connected to the display substrate and a second part connected to the IC mounting substrate. This segmentation allows each part to have optimized properties: the first part can accommodate bending deformation while the second part maintains stable IC mounting, resolving the contradiction between flexibility and adhesion strength.
Solution Approach 2:
Different regions of the substrate connecting part are given different characteristics. The first part has properties suitable for flexible connection to the display substrate, while the second part has properties optimized for stable IC mounting. This local differentiation allows the system to simultaneously achieve flexibility and reliable IC attachment.
2Device complexity
If the substrate connecting part has the same length as the IC mounting substrate, then the structural simplicity is improved, but the risk of IC breaking and misalignment increases during bending
Solution Approach 1:
The substrate connecting part is segmented into two distinct parts with different lengths. The first part (connected to display substrate) and second part (connected to IC mounting substrate) have optimized length ratios that prevent excessive stress concentration during bending, thereby reducing IC breaking risk while maintaining reasonable structural complexity.
Solution Approach 2:
The length ratio between the first part and second part of the substrate connecting part is optimized to specific ranges. This parameter optimization ensures that during bending deformation, the stress distribution protects the IC from breaking and prevents misalignment, while keeping the overall structure relatively simple.
Data Source
AI summary
A display device comprises a display panel including: a display substrate; an IC mounting substrate which is arranged along the side edge of the display substrate and provided with a display driving IC mounted thereon by face-down bonding; and a substrate connecting part which connects the display substrate and the IC mounting substrate. The substrate connecting part connected to the display substrate has a smaller length than the IC mounting substrate in the direction of extension of the side edge of the display substrate.