Display Apparatus Inorganic Insulating Layer Atomic Layer Deposition

The patent removes the metal mask from the fabrication process entirely, extracting the source of dimensional inaccuracy and positional deviation. Instead of using vacuum evaporation with a metal mask, the invention employs a printing method where light-emitting layers are directly deposited in island shapes onto the substrate, eliminating mask-related errors such as positional deviation, warp, and vapor scattering.

The patent replaces the mechanical vacuum evaporation system with a printing system. Instead of using mechanical masks and vapor deposition, the invention uses a printing head with nozzles to deposit light-emitting materials directly in controlled patterns, achieving high dimensional accuracy and positional precision through precise control of the printing head movement and nozzle positioning.

The printing method allows for self-correcting deposition where the light-emitting material is placed precisely where needed without relying on mask alignment. The printing head can adjust its positioning and the deposition process inherently ensures accurate placement, eliminating the cumulative errors that reduce yield in conventional high-resolution manufacturing.

The patent changes the fundamental deposition parameters from vacuum evaporation to printing-based material placement. This includes controlling droplet size, deposition speed, and positioning accuracy through printing parameters, enabling high resolution while maintaining high yield by avoiding the dimensional inaccuracies that plague conventional methods.