Display Device Input Sensing Layer Design
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Solution Overview
Problem
Current display devices face challenges in effectively detecting external inputs due to limitations in the design and structure of their input sensing layers, particularly when these inputs approach the display panel from certain angles or regions.
Innovation Solution
The method involves forming a dielectric layer and a conductive layer on an encapsulation layer of a display panel, with specific photoresist layers and etching processes to create conductive patterns that overlap different encapsulation regions, allowing for increased detectability of external inputs by varying the thickness and line-width of these patterns based on the region's shape.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a uniform input sensing layer is used across the display panel, then the manufacturing process is simple, but the detectability of external inputs from nonstandard angles is poor
Solution Approach 1:
The input sensing layer is divided into multiple regions (first input sensing region and second input sensing region) with different line-widths. The first region has a narrower line-width for standard angle inputs, while the second region has a wider line-width for nonstandard angle inputs. This local differentiation improves detectability across various input angles without requiring a completely redesigned sensing layer structure.
Solution Approach 2:
The encapsulation layer is segmented into a first encapsulation region and a second encapsulation region, which correspond to different input sensing regions. This segmentation allows each region to be optimized independently for its specific input angle requirements, enabling the system to handle both standard and nonstandard angle inputs effectively.
2Reliability
If the line-width of conductive patterns is increased to improve detectability, then detection reliability improves, but manufacturing precision requirements increase
Solution Approach 1:
Different line-widths are assigned to different regions of the conductive pattern based on local requirements. The first conductive pattern has a narrower line-width for standard angle detection, while the second conductive pattern has a wider line-width for nonstandard angle detection. This localized adjustment allows each region to be optimized for its specific function without uniformly increasing precision requirements across the entire structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the detection reliability of external inputs, especially when the inputs approach the display panel from non-standard angles, improving the overall performance of the input sensing layer.
Implementation Method 1
forming a first photoresist layer on the conductive layer that overlaps each of the first encapsulation region and the second encapsulation region; forming a second photoresist layer on the first photoresist layer that overlaps the second encapsulation region
Implementation Method 2
etching the conductive layer based on the first photoresist layer and the second photoresist layer
Data Source
AI summary
Disclosed is a method of fabricating a display device. The method comprises forming a dielectric layer on an encapsulation layer including a first encapsulation region and a second encapsulation region adjacent to the first encapsulation region, forming a conductive layer on the dielectric layer, forming a first photoresist layer on the conductive layer that overlaps each of the first and second encapsulation regions, forming a second photoresist layer on the first photoresist layer that overlaps the second encapsulation region, and etching the conductive layer based on the first and second photoresist layers. When viewed in a thickness direction of a display panel including the encapsulation layer, at least a portion of the encapsulation layer overlapping the second encapsulation region has a thickness greater than that of the encapsulation layer overlapping the first encapsulation region.