Flexible Display Insulating Structure for Impact Crack Resistance
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Solution Overview
Problem
Existing flexible display apparatuses are vulnerable to external impacts, leading to cracks and defects in signal lines due to the higher hardness of inorganic insulating layers.
Innovation Solution
A multi-layered insulating structure comprising a first inorganic insulating layer, a first organic insulating layer, a second inorganic insulating layer, and a second organic insulating layer, with holes filled with organic material, is used to absorb stress and prevent crack propagation in the inorganic layers, enhancing robustness against external impacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If inorganic insulating layers are used to provide structural support and electrical insulation, then manufacturing precision and electrical stability are improved, but vulnerability to external impacts and crack propagation increases
Solution Approach 1:
The patent applies composite materials by combining inorganic insulating layers (silicon oxide, silicon nitride) with organic insulating layers (polyimide, polyethylene terephthalate) to create a multi-layered insulating structure. This composite structure leverages the high hardness and electrical stability of inorganic materials while incorporating the flexibility and stress-absorbing properties of organic materials, thereby resolving the contradiction between manufacturing precision and resistance to external impact.
Solution Approach 2:
The patent applies local quality by strategically positioning holes at specific locations within the inorganic insulating layers, particularly in regions prone to stress concentration. These holes are filled with organic material that has different mechanical properties, creating localized regions that absorb stress and prevent crack propagation, while maintaining the overall structural integrity and electrical insulation properties of the inorganic layers.
2Reliability
If inorganic insulating layers are used to maintain electrical insulation, then electrical stability is improved, but crack propagation under external impact increases
Solution Approach 1:
The patent applies the intermediary principle by introducing organic material-filled holes as mediator structures between the inorganic insulating layers and the external environment. These intermediary structures absorb and distribute the stress from external impacts, preventing direct transmission of mechanical stress to the inorganic layers and thereby preventing crack propagation while maintaining electrical insulation stability.
Solution Approach 2:
The patent applies beforehand cushioning by pre-positioning holes filled with organic material within the inorganic insulating layers before external impacts occur. These pre-configured structures act as stress-absorbing cushions that mitigate the effects of external impacts, preventing crack initiation and propagation in the brittle inorganic layers while preserving electrical insulation properties.
3Device complexity
If a simple insulating layer structure is used, then device complexity is reduced, but stress absorption capability and impact resistance deteriorate
Solution Approach 1:
The patent applies segmentation by dividing the insulating layer structure into multiple distinct layers (first inorganic insulating layer, first organic insulating layer, second inorganic insulating layer, second organic insulating layer) with different materials and functions. Each layer is segmented to perform specific functions: inorganic layers provide electrical insulation and structural support, while organic layers provide stress absorption and flexibility, thereby resolving the contradiction between structural simplicity and stress absorption capability.
Solution Approach 2:
The patent applies composite materials by creating a multi-layered structure combining inorganic and organic materials with complementary properties. This composite structure achieves superior stress absorption and impact resistance compared to simple single-material insulating layers, while maintaining reasonable device complexity through systematic layering and hole-filling techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The multi-layered insulating structure minimizes the influence of external impacts by absorbing stress with organic material layers, reducing the probability of crack propagation and maintaining the integrity of signal lines.
Implementation Method 1
A multi-layered insulating structure comprising a first inorganic insulating layer, a first organic insulating layer, a second inorganic insulating layer, and a second organic insulating layer, with holes filled with organic material, is used to absorb stress and prevent crack propagation in the inorganic layers
Data Source
AI summary
A display apparatus includes a substrate, a thin film transistor, a first inorganic insulating layer, a first organic insulating layer, a second inorganic insulating layer, and a second organic insulating layer. The thin film transistor is over the substrate and includes a semiconductor layer and a gate electrode. The first inorganic insulating layer includes a first insulating layer between the semiconductor layer and the gate electrode of the thin film transistor and a second insulating layer over the gate electrode. The first organic insulating layer is over the first inorganic insulating layer. The second inorganic insulating layer is over the first organic insulating layer. The second organic insulating layer is over the second inorganic insulating layer. At least one hole passing through the first inorganic insulating layer and the second inorganic insulating layer is formed in a peripheral portion of the thin film transistor.