Display Device Insulating Film Gap Compensation
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Solution Overview
Problem
Display devices in mobile and stationary electronic devices often suffer from bubble defects due to gaps between the insulating film and the circuit board, which can lead to manufacturing inefficiencies and increased defect rates.
Innovation Solution
A display device design that minimizes the gap between the insulating film and the circuit board by using a compensation pattern or cavities on the circuit board, allowing for better adhesive filling and reduced bubble formation, thereby reducing defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the insulating film is positioned close to the circuit board (0 to 0.1 mm gap), then adhesive filling is improved and bubble defects are reduced, but manufacturing precision requirements are increased
Solution Approach 1:
A compensation pattern (protrusion or recess) is introduced as an intermediary structural element between the insulating film and the circuit board. This compensation pattern adjusts the effective gap distance and provides a mechanical interface that ensures complete adhesive filling while accommodating normal manufacturing tolerances, thus resolving the contradiction between achieving small gaps and maintaining manufacturing precision.
2Strength
If adhesive is applied to fill the gap between insulating film and circuit board, then bonding strength is improved, but bubble formation risk increases if gap is not properly controlled
Solution Approach 1:
The compensation pattern is designed in advance to pre-determine the optimal gap distance and adhesive distribution. By establishing the correct geometric relationship between the insulating film, compensation pattern, and circuit board before adhesive application, the structure ensures that adhesive completely fills the gap without trapping air bubbles, thus achieving both strong bonding and bubble-free assembly.
3Ease of manufacture
If the insulating film is spaced further from the circuit board, then assembly tolerance is improved, but adhesive filling becomes incomplete and bubble defects increase
Solution Approach 1:
Rather than uniformly reducing the gap across the entire assembly, the compensation pattern creates a localized structural feature that specifically addresses the adhesive filling region. This local modification allows the gap to be optimized for adhesive flow and complete filling at the critical interface, while maintaining larger tolerances in other areas of the assembly, thus resolving the contradiction between assembly tolerance and adhesive filling completeness.
Data Source
AI summary
A display device including a display panel for displaying an image on a front surface of the display panel; a touch sensing unit provided on the display panel to sense a touch; an insulating film covering the touch sensing unit; a first circuit board of which one end is connected to the touch sensing unit; and a polarizing layer covering the touch sensing unit and a portion of the first circuit board.