Display Device Insulating Layer Segmentation for Uniform Thickness
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Solution Overview
Problem
Current display devices face challenges in minimizing thickness while maintaining improved display quality, particularly in achieving uniform insulating layers and efficient capacitor structures for high-resolution displays.
Innovation Solution
The implementation of a display device structure that includes a substrate with a specific configuration of conductive and insulating layers, where the second sub-insulating layer has a tapered shape and different etching rates compared to the first sub-insulating layer, allowing for a dual-layer structure in the third conductive layer with titanium and molybdenum, and the use of silicon oxide and silicon nitride materials for the insulating layers to achieve a uniform thickness and efficient capacitor formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a single-layer insulating structure is used, then the manufacturing process is simpler, but the uniformity of insulating layer thickness deteriorates
Solution Approach 1:
The insulating layer is divided into multiple sub-layers (first sub-insulating layer and second sub-insulating layer), each with different materials and etching rates. This segmentation allows independent optimization of each layer's thickness and properties, achieving overall uniformity that cannot be obtained with a single layer.
Solution Approach 2:
Different insulating materials (e.g., silicon oxide and silicon nitride) are combined in a multi-layer structure. Each material is selected for its specific etching rate and electrical properties, creating a composite structure that achieves both manufacturing feasibility and precise thickness control.
2Length of moving object
If the display device thickness is reduced, then the miniaturization is improved, but the capacitor capacity deteriorates
Solution Approach 1:
The capacitor structure utilizes the thickness dimension by forming stacked conductive layers (third conductive layer with titanium and molybdenum) separated by insulating layers. This vertical stacking increases capacitor capacity without increasing the planar area, effectively utilizing the thickness dimension for capacity enhancement while maintaining overall device miniaturization.
Solution Approach 2:
Multiple conductive and insulating layers are nested vertically to form a compact capacitor structure. The third conductive layer is nested between insulating layers, creating a multi-layer capacitor that maximizes capacity within the limited thickness budget.
3Manufacturing precision
If different materials are used for sub-insulating layers, then the etching selectivity is improved, but the material complexity deteriorates
Solution Approach 1:
Different materials with distinct etching parameters (etching rates, selectivity ratios) are selected for each sub-insulating layer. This allows precise control over the etching process, enabling selective removal of specific layers while preserving others, which is critical for forming the capacitor structure with the desired geometry.
Data Source
AI summary
A display device including: a substrate; an active layer, and including channel and conductive regions; a first conductive layer including a driving gate electrode and a scan line in a first direction; a second conductive layer including a storage line; a third conductive layer including a first connecting member above the storage line; an insulating layer between the storage line and the first connecting member; and a data line and a driving voltage line crossing the scan line in a second direction, wherein the first connecting member electrically connects the driving gate electrode and a conductive region, the driving voltage line overlaps the first connecting member, the insulating layer includes first and second sub-insulating layers, and an edge of the second sub-insulating layer substantially overlaps an edge of the first connecting member in a thickness direction of the display device.