Multi-Layer Display Insulation for Impact-Resistant Transistors

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Solution Overview

Problem

Existing bendable or extensible display devices face issues with damage to light-emitting elements or wires when the stretchable substrate is stretched or subjected to impact, due to the lack of effective protection against mechanical stress.

Innovation Solution

A display device design featuring a multi-layer insulating film with distinct regions, where a first insulating film with a higher modulus is used in regions not overlapping transistors, and a second insulating film with a lower modulus overlaps the transistors, effectively distributing and absorbing mechanical stress.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single-layer insulating film is used in extensible display devices, then the device structure is simple, but the light-emitting elements or wires are damaged when the stretchable substrate is stretched or subjected to impact

Engineering Contradiction:
Improveinsulating film structureVSAvoidimpact resistance
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The insulating film is divided into multiple layers with different moduli. The first insulating film has a higher modulus and the second insulating film has a lower modulus. This segmentation allows each layer to perform different functions: the higher modulus layer provides structural support while the lower modulus layer absorbs mechanical stress, thereby improving impact resistance without excessive complexity

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent uses a composite insulating film structure combining materials with different mechanical properties. The first insulating film (higher modulus) and second insulating film (lower modulus) are stacked to create a composite structure that leverages the strengths of each material - structural integrity from the rigid layer and stress absorption from the flexible layer

Inventive Principle:
Principle #40Composite materials

2Adaptability or versatility

If the stretchable substrate is made more flexible to enable bending, then the device becomes bendable, but the light-emitting elements or wires stacked on the upper portion are damaged when stretched or impacted

Engineering Contradiction:
ImprovebendabilityVSAvoidmechanical protection
Core Design Contradiction:
Adaptability or versatilityVSStrength

Solution Approach 1:

Different regions of the insulating film structure have different mechanical properties. The first insulating film with higher modulus provides localized structural support in regions where strength is needed, while the second insulating film with lower modulus provides flexibility and stress absorption in regions where bendability is required. This local differentiation of mechanical properties allows the device to be both bendable and mechanically protected

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the impact resistance of the display device by transmitting mechanical stress through the higher modulus first insulating film, thereby protecting the transistors under the lower modulus second insulating film, and preventing bright spot failures.

Implementation Method 1

a modulus of the second insulating film may be lower than a modulus of the first insulating film

Methodology Applied
Scientific EffectStress distribution and absorption: Elasticity

Data Source

PatentUS12274134B2Display device
Publication Date: 2025.04.08 SAMSUNG DISPLAY CO LTD
  • US12274134B2 patent drawing
  • US12274134B2 patent drawing
  • US12274134B2 patent drawing

AI summary

A display device including: a substrate; a plurality of transistors disposed on the substrate; and a multi-layer insulating film disposed on the transistors, wherein the multi-layer insulating film includes a first insulating film and a second insulating film, the multi-layer insulating film includes a first region in which the first insulating film and the second insulating film overlap each other in a direction perpendicular to the substrate and a second region in which the first insulating film is disposed, the first region overlaps the plurality of transistors, and a modulus of the second insulating film is lower than a modulus of the first insulating film.