Inter-Substrate Via Hole for Display Frame Width Reduction
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Solution Overview
Problem
Current display devices face challenges in reducing the frame width due to the need for additional wiring substrates and complex terminal connections, which increases costs and reduces the flexibility in substrate layout.
Innovation Solution
A display device configuration featuring a first and second substrate with an organic insulating layer, where a first hole in the second substrate and a second hole in the organic insulating layer or second substrate communicate to connect terminals via a connecting material, eliminating the need for a separate wiring substrate and allowing for reduced frame width and improved layout flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate wiring substrate is used to connect terminals between first and second substrates, then electrical connection is achieved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the wiring function into the second substrate by forming a via hole that penetrates through the second basement and organic insulating layer to directly connect the first terminal to the second terminal. This eliminates the need for a separate wiring substrate, reducing device complexity while maintaining electrical connection reliability.
Solution Approach 2:
The patent extracts the wiring function from a separate wiring substrate and integrates it directly into the second substrate structure. The via hole serves as both a structural element of the second substrate and a wiring path, removing the unnecessary intermediate wiring substrate layer.
2Reliability
If additional wiring substrates and complex terminal connections are used, then electrical connection is achieved, but frame width cannot be reduced
Solution Approach 1:
The patent transitions from a planar wiring arrangement to a three-dimensional vertical connection by forming a via hole that penetrates through the second basement and organic insulating layer. This vertical dimension allows terminal connections without increasing frame width, as the connection path is established in the thickness direction rather than expanding the lateral footprint.
3Reliability
If additional wiring substrates are used, then terminal connection is achieved, but production cost increases
Solution Approach 1:
The patent combines multiple functions (structural support and electrical wiring) into the second substrate, eliminating the need for a separate wiring substrate. This reduces the number of components and assembly steps, thereby lowering production costs while maintaining reliable terminal connection.
Data Source
AI summary
According to one embodiment, a display device includes a first substrate including a first basement and a first terminal, a second substrate opposing the first substrate and including a second basement and a second terminal, an organic insulating layer located between the first basement and the second basement, a first hole penetrating the second basement and the organic insulating layer, a second hole penetrating at least one of the second basement and the organic insulating layer and communicating to the first hole and a connecting material provided at least one of the first hole and the second hole to electrically connect the first terminal and the second terminal to each other.