Display Device Signal Interconnect Inspection via Transparent Substrate
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Solution Overview
Problem
The existing methods for inspecting signal interconnects in liquid crystal display devices are time-consuming and inefficient, especially when substrate chipping or cracking occurs, making it difficult to detect disconnections between the touch panel and liquid crystal display panel.
Innovation Solution
A display device with a transparent substrate having detection electrodes and flexible interconnect substrates, where signal interconnects are formed with open ends for easy inspection, allowing for visual and electrical verification of connectivity without increasing manufacturing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the touch panel is attached to the liquid crystal display panel on the display side with a light shielding film covering the interconnect region, then the display quality and touch detection accuracy are improved, but the visual inspection of signal interconnects becomes extremely difficult
Solution Approach 1:
Instead of inspecting the signal interconnects directly through the light shielding film (which blocks visibility), the patent inverts the approach by forming an inspection pattern on the opposite side of the substrate. This allows inspection through the transparent substrate from the non-display side, bypassing the light shielding film obstacle while maintaining display quality and touch detection accuracy.
2Measurement precision
If conventional inspection methods are used to detect signal interconnect disconnections, then detection accuracy is maintained, but inspection time increases significantly
Solution Approach 1:
The patent applies preliminary action by forming an inspection pattern during the manufacturing process before final assembly and inspection. This pattern is created in advance to facilitate rapid visual inspection, eliminating the need for time-consuming conventional inspection methods while maintaining high detection accuracy for interconnect defects.
Solution Approach 2:
The inspection pattern acts as a visual copy or representation of the signal interconnect layout. By creating this pattern on the substrate surface, inspectors can visually trace and verify interconnect continuity without performing complex electrical tests, significantly reducing inspection time while maintaining accuracy.
3Ease of manufacture
If the glass substrate is cut into individual liquid crystal display devices, then device fabrication is completed, but substrate chipping or cracking can disconnect signal interconnects
Solution Approach 1:
The patent applies preliminary action by forming the inspection pattern before the substrate cutting process. This allows inspection of signal interconnect continuity to be performed on the multi-device substrate while still in a stable state, before cutting operations that may cause chipping or cracking. Any interconnect defects are detected and addressed before final device separation.
Solution Approach 2:
The inspection pattern provides a preventive mechanism by enabling early detection of potential interconnect vulnerabilities before the cutting process. This allows manufacturers to identify and address weak points in the interconnect structure before they result in actual disconnections during or after substrate division.
Data Source
AI summary
A display device includes a display panel, a light shielding plate having an opening, a protective plate, and a coordinate input device having a transparent substrate, and a first flexible interconnect substrate. The coordinate input device is disposed on the display panel at the side of a display screen, and each of the light shielding plate and the protective plate is arranged on the coordinate input device on the opposite side of the display panel. The coordinate input device has first signal interconnects and a second signal interconnect disposed outside the first signal interconnects but near a peripheral edge of the transparent substrate. The second signal interconnect is formed of a thin conductive film disposed along a peripheral edge portion of the transparent substrate, and is disposed along the peripheral edge of three sides of the transparent substrate.