Multi-Layer Display Interconnects Across Openings for Thin Bezels
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Solution Overview
Problem
Display devices with non-display areas or openings on substrates face limitations in achieving thin bezels due to wiring constraints, leading to inadequate design that fails to meet consumer needs for lightweight and compact electronic products.
Innovation Solution
The implementation of a display device structure with multiple conductive layers and insulating layers, where the third conductive layer extends into the non-display area, allowing electrical connection with the first and second conductive layers, thereby enabling signal transmission without causing short circuits and allowing for thin bezels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wirings and components surround a non-display area or opening, then electrical connection is maintained, but bezel thickness increases and thin bezel design becomes unachievable
Solution Approach 1:
The patent transitions wiring from a two-dimensional planar layout to a three-dimensional multi-layer structure. Conductive lines are arranged across multiple stacked layers (first conductive layer, second conductive layer, third conductive layer) with insulating layers between them, allowing wires to pass through vertical space rather than occupying horizontal space, thereby enabling thin bezels while maintaining electrical connectivity.
Solution Approach 2:
The patent implements a nested multi-layer structure where conductive layers are embedded within insulating layers. The first conductive layer is surrounded by insulating material, which in turn is surrounded by the second conductive layer, and so on. This nested arrangement allows multiple wiring paths to be compactly organized in the vertical dimension without interfering with each other, solving the bezel thickness problem.
2Length of stationary object
If multiple conductive layers are stacked to enable thin bezels, then bezel thickness is reduced, but device complexity increases
Solution Approach 1:
The patent segments the wiring system into multiple independent conductive layers (first, second, and third conductive layers), each separated by insulating layers. This segmentation allows each layer to carry specific signal paths independently, reducing interference and simplifying the routing design within each layer while achieving the overall thin bezel goal through the stacked configuration.
Data Source
AI summary
A display device includes: a substrate having display and non-display areas; a first conductive layer including first and second sub-conductive lines; a second conductive layer including third and fourth sub-conductive lines, wherein, in the display area, the first sub-conductive line and the third sub-conductive lines cross from a top view; and a third conductive layer including third conductive lines and corresponding to the non-display area; wherein, corresponding to the non-display area, a portion of a projection of the one of the third conductive lines is overlapped with a portion of a projection of the second sub-conductive line on the substrate, and another portion of the projection of the one of the third conductive lines is overlapped with a portion of a projection of the fourth sub-conductive line on the substrate.