Foldable Display Panel Laser Cutting for Carrier Film Removal
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing manufacturing processes for display devices face challenges in ensuring reliable removal of carrier films without damaging the display panel, which affects process reliability and increases costs.
Innovation Solution
A method of manufacturing a display device that involves providing a work panel with a display panel and a carrier film, and cutting the work panel using a laser beam. The carrier film has distinct areas with different laser cutting conditions, allowing for efficient removal without damaging the display panel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional carrier film removal processes are used, then the display panel can be manufactured, but the process reliability is low and the manufacturing time is prolonged
Solution Approach 1:
The laser cutting process creates a separation layer between the carrier film and display panel in advance, forming a first side surface with an inclined surface that facilitates subsequent carrier film removal. This preliminary action prepares the interface for easy detachment without requiring complex removal processes later.
Solution Approach 2:
The invention uses laser beam parameters (power, speed, pulse width) to precisely control the cutting depth and angle, creating different side surfaces (first side surface with inclined surface, second side surface) that enable reliable and efficient carrier film removal while reducing manufacturing time.
2Reliability
If conventional carrier film removal processes are used, then the display panel can be manufactured, but additional processing steps are required increasing device complexity
Solution Approach 1:
The invention combines the carrier film removal function into the laser cutting process itself. The same laser cutting step that separates the work panel also creates the separation layer and inclined surfaces needed for carrier film removal, eliminating the need for separate removal processes and reducing overall process complexity.
Solution Approach 2:
The laser-cutted first side surface with its inclined surface acts as an intermediary structure that facilitates carrier film removal. This intermediate structure enables easy detachment without requiring additional complex removal mechanisms or processes.
3Ease of manufacture
If uniform laser beam conditions are used for cutting, then the cutting process is simple, but the carrier film cannot be easily removed
Solution Approach 1:
The invention applies different laser beam conditions to different cutting lines: the first cutting line uses conditions that create an inclined surface for easy carrier film removal, while the second cutting line uses different conditions for its specific requirements. This local differentiation optimizes both manufacturing ease and carrier film removal ease.
Solution Approach 2:
The cutting process is segmented into different cutting lines (first cutting line, second cutting line) with different laser parameters. This segmentation allows each cutting line to be optimized for its specific function, with the first cutting line specifically designed to create the inclined surface that facilitates carrier film removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves process reliability by facilitating easy removal of the carrier film, reduces manufacturing time, and lowers costs by eliminating the need for additional processing steps.
Implementation Method 1
cutting the work panel by irradiating a laser beam on to the work panel
Data Source
AI summary
A manufacturing method of a display device includes providing a work panel including a display panel including a folding area, and a carrier film disposed under the display panel and including a first area and a second area, wherein a peeling tape is attached to the first area and the second area is adjacent to the first area, and cutting the work panel by irradiating a laser beam on to the work panel. The cutting of the work panel includes irradiating the laser beam along a first cutting line corresponding to the first area under a first condition, and irradiating the laser beam along a second cutting line corresponding to the second area under a second condition different from the first condition.