Display Module Laser Cutting With Sidewall Adhesive Sealing
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Solution Overview
Problem
Laser cutting in the display field often damages substrates, allowing water vapor and oxygen to permeate and cause dark-spot defects due to incomplete sealing of cutting grooves.
Innovation Solution
A cutting method for display modules that involves forming a first through hole in a spacing layer with encapsulation adhesive, which is melted during laser cutting to cover the sidewalls of the cutting groove, preventing water and oxygen ingress by adjusting laser irradiation time and intensity, and subsequently curing the adhesive to ensure complete sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser cutting is performed on the display panel to form cutting grooves, then the display module can be divided and processed, but the substrate may be damaged and water vapor/oxygen may permeate into the substrate causing dark-spot defects
Solution Approach 1:
The patent applies preliminary action by pre-coating the cutting groove sidewalls with encapsulation adhesive before laser cutting. This adhesive layer is prepared in advance and positioned to cover the sidewalls that will be exposed after cutting, so that when the laser forms the cutting groove, the adhesive immediately seals the groove, preventing water vapor and oxygen from penetrating into the substrate and causing dark-spot defects.
Solution Approach 2:
The patent uses encapsulation adhesive as an intermediary substance between the laser cutting process and the substrate. This adhesive layer acts as a protective mediator that seals the cutting groove sidewalls, blocking the harmful interaction between environmental moisture/oxygen and the substrate, thereby preventing dark-spot defects while allowing the cutting process to proceed efficiently.
2Reliability
If the encapsulation adhesive layer is too thick, then it can provide better sealing, but it increases the overall module thickness and may affect display quality
Solution Approach 1:
The patent applies local quality by making the encapsulation adhesive coating thickness location-dependent. The adhesive is coated on the cutting groove sidewalls with a thickness that is sufficient to provide sealing (0.1-10 μm), but not excessively thick. This localized thickness control ensures adequate sealing performance at the critical cutting groove interface while maintaining overall module thinness and avoiding impact on display quality.
Solution Approach 2:
The patent uses parameter changes by precisely controlling the encapsulation adhesive coating thickness within a specific range (0.1-10 μm). This parameter optimization balances the conflicting requirements: thick enough to provide effective sealing against water vapor and oxygen, but thin enough to maintain overall module thinness and avoid affecting display optical quality.
3Productivity
If the laser intensity is increased to improve cutting speed, then productivity increases, but the substrate may be more easily damaged
Solution Approach 1:
The patent applies beforehand cushioning by pre-coating the cutting groove sidewalls with encapsulation adhesive before laser cutting. This adhesive layer serves as a protective cushion that absorbs and distributes the laser energy, reducing direct thermal damage to the substrate. This allows the use of higher laser intensities for faster cutting while the adhesive layer protects the substrate from excessive heat and damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively prevents cracks and water vapor/oxygen permeation, reducing dark-spot defects and enhancing the structural integrity of the display module by ensuring the encapsulation adhesive covers and cures on the cutting groove sidewalls, thereby protecting the display panel from external forces and heat diffusion.
Implementation Method 1
performing laser cutting on the display module to be cut at a position of the region to be cut so as to remove the region to be cut to form a cutting groove, wherein in the laser cutting, at least part of the encapsulation adhesive is melted and covers a sidewall of the cutting groove
Implementation Method 2
at least part of the encapsulation adhesive is melted and covers a sidewall of the cutting groove
Implementation Method 3
the step of curing the encapsulation adhesive covering the sidewall of the cutting groove includes: performing ultraviolet heating and exposure on the encapsulation adhesive covering the sidewall of the cutting groove
Implementation Method 4
a material to be cut is irradiated with a high-power-density laser beam, so that the material is quickly heated to a vaporization temperature and evaporated to form a hole
Implementation Method 5
the material is quickly heated to a vaporization temperature and evaporated to form a hole
Data Source
AI summary
The present disclosure provides a cutting method of a display module, including: providing a display module to be cut, the display module to be cut including a display panel and a spacing layer on the display panel, and the display panel including a region to be cut, the spacing layer being provided with a first through hole exposing the region to be cut, and the first through hole being provided therein with an encapsulation adhesive; and performing laser cutting on the display module to be cut at a position of the region to be cut so as to remove the region to be cut to form a cutting groove. In the laser cutting, at least part of the encapsulation adhesive is melted and covers a sidewall of the cutting groove.