Display Substrate Laser Cutting Around Pad Portions
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Solution Overview
Problem
Existing methods for manufacturing display devices face challenges in cutting substrates without damaging pad portions, which are crucial for maintaining the functionality and integrity of the display components.
Innovation Solution
An apparatus is employed that includes a first and a second laser part, controlled by a controller, to cut a mother substrate along specific cutting lines, utilizing laser beams with precise wavelength and pulse width configurations, allowing for the separation of substrates and pad portions without damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single laser beam is used to cut the mother substrate, then the cutting speed is high, but it is difficult to avoid damaging the pad portions
Solution Approach 1:
The single laser beam is divided into multiple laser beams (first laser beam, second laser beam, third laser beam) that can be independently controlled. This segmentation allows different beams to perform different functions: cutting substrates and selectively avoiding pad portions, thereby resolving the contradiction between cutting speed and precision.
Solution Approach 2:
The patent employs dynamic control of multiple laser beams where the first and second laser beams are selectively activated based on real-time positioning relative to pad portions. This dynamic switching enables the system to adapt between high-speed cutting mode and precision-safe mode, maintaining both productivity and manufacturing precision.
2Manufacturing precision
If multiple laser beams are used to cut different substrates, then the precision of cutting without damaging pad portions is improved, but the device complexity increases
Solution Approach 1:
Multiple laser beams are controlled by a single controller that manages the entire cutting process. The same laser source is dynamically configured to produce different beams for different cutting tasks, reducing device complexity while maintaining precision through software-controlled multi-functionality.
Solution Approach 2:
A controller acts as an intermediary between the laser source and the cutting process, coordinating multiple laser beams and their timing. This central control mechanism simplifies the overall system architecture by providing unified management of multiple laser components, thereby reducing device complexity while achieving high precision cutting.
3Manufacturing precision
If the laser beam parameters are not precisely controlled, then the cutting process is simple, but the integrity of display and pad portions cannot be preserved
Solution Approach 1:
The system incorporates feedback mechanisms where the controller monitors the cutting process and adjusts laser beam parameters in real-time based on the position of substrates and pad portions. This feedback control ensures precise integrity preservation while managing complexity through automated closed-loop control.
Solution Approach 2:
The patent utilizes precise control of laser beam parameters (wavelength, pulse width, intensity) to achieve different cutting effects. By dynamically changing these parameters based on the cutting context, the system preserves the integrity of display and pad portions while maintaining manageable control complexity through parameter optimization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively divides the mother substrate into cells, preserving the integrity of display and pad portions, enabling the production of functional display devices with improved precision and efficiency.
Implementation Method 1
a first laser part disposed on the stage and that emits a first laser beam cutting the first substrate
Implementation Method 2
a second laser part disposed on the stage and that emits a second laser beam cutting the second substrate
Data Source
AI summary
Provided is an apparatus for manufacturing a display device, the apparatus cutting a mother substrate along a cutting line, wherein the mother substrate includes a first substrate, a second substrate disposed on the first substrate, and a plurality of display portions and a plurality of pad portions, which are arranged between the first substrate and the second substrate.