Display Panel Laser Pattern Repair for Photolithography Errors
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Solution Overview
Problem
Existing display panel manufacturing methods face errors in photolithography processes, leading to inaccuracies in patterning semiconductor and conductive materials, which affect the performance and reliability of transistors and overall display quality.
Innovation Solution
A display panel manufacturing method and apparatus that utilizes a laser patterning process to correct errors by detecting machining target areas, removing overlapping layers, and forming precise patterns using electrohydrodynamic ink nozzles for insulation and metal inks, with the laser module and curing module integrated into the manufacturing apparatus to ensure accurate and efficient pattern formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If photolithography processes are used for patterning, then manufacturing process is simple, but patterning precision deteriorates due to errors in photolithography
Solution Approach 1:
The patent replaces the photolithography process (optical/mechanical system) with a laser-based patterning system. The laser beam is used to directly write and pattern the organic conductive material layer, eliminating the need for photolithography masks and development processes. This substitution significantly improves patterning precision while maintaining reasonable process complexity through automated laser writing.
Solution Approach 2:
The laser patterning process is self-correcting in nature. The system can detect and compensate for substrate irregularities and previously formed pattern deviations during the laser writing process, automatically adjusting the beam position and parameters to achieve the desired pattern geometry without requiring external alignment steps or correction processes.
2Manufacturing precision
If photolithography processes are used, then manufacturing time is reduced, but pattern accuracy deteriorates
Solution Approach 1:
The patent replaces multi-step photolithography processes with direct laser writing, which eliminates mask alignment, exposure, and development steps. The laser beam directly writes the pattern onto the organic conductive material layer, achieving high pattern accuracy in a single step while reducing overall manufacturing time.
Solution Approach 2:
The laser patterning process operates continuously, with the laser beam moving along the substrate to write patterns without interruption. The system maintains continuous scanning and writing operations, eliminating the discrete steps and waiting periods inherent in photolithography processes, thereby improving both accuracy and productivity.
3Manufacturing precision
If conventional patterning methods are used, then manufacturing process is simple, but line-width control deteriorates
Solution Approach 1:
The patent replaces conventional photolithography patterning with laser-based direct writing. The laser beam parameters (power, pulse duration, scanning speed) are precisely controlled to achieve accurate line-width definition in the organic conductive material layer, eliminating the line-width limitations imposed by photolithography resolution and mask quality.
Solution Approach 2:
The system controls line-width through dynamic adjustment of laser parameters including beam power, pulse width, scanning speed, and beam focus position. By changing these parameters during the writing process, the system can precisely control the deposited material amount and resulting line-width, achieving superior control compared to fixed photolithography processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method and apparatus enable the formation of precise patterns with smaller line-widths and improved electrical conductivity, reducing manufacturing time and enhancing the reliability and performance of display panels by correcting photolithography errors and ensuring accurate transistor formation.
Implementation Method 1
removing an area overlapping the machining target area of a top layer disposed on the bottom layer; removing an area overlapping the machining target area of an insulation layer disposed on the bottom layer; emitting a laser beam to the machining target area of the bottom layer
Implementation Method 2
the insulation ink may be provided from an electrohydrodynamic (EHD) insulation ink nozzle; the metal ink may be provided from an electrohydrodynamic metal ink nozzle
Implementation Method 3
the forming of the insulation pattern may include: providing an insulation ink to the removed area of the insulation layer; and curing the insulation ink; the forming of the compensation pattern may include: providing a metal ink to the removed area of the top layer; and curing the metal ink
Data Source
AI summary
Provided are display panel manufacturing method and apparatus. The display panel manufacturing method includes detecting a machining target area of a bottom layer, removing an area, overlapping the machining target area, of a top layer, emitting a laser beam to the machining target area of the bottom layer to provide a bottom pattern from the machining target area, and providing a compensation pattern in the removed area of the top layer.