Display Layer Laser Ablation With Optical Property Preservation
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Solution Overview
Problem
Current manufacturing processes for display devices face challenges in preserving the optical properties of layers with different absorptance and refractive indices, and in adjusting adhesive forces between layers, which affects processing quality and layer integrity.
Innovation Solution
A method using a pulsed laser beam with a nanosecond-scale pulse width to selectively remove specific layers in a multi-layer structure, where the absorptance and refractive index differences are utilized to preserve low-absorptance layers and adjust interfacial adhesive forces by varying the laser beam's spot radius.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a laser beam is used to remove layers in a multi-layer structure, then processing speed and precision are improved, but heat-affected zones and carbonized foreign substances increase
Solution Approach 1:
The patent applies periodic pulsed laser irradiation instead of continuous laser exposure. The pulse width is controlled to be 10 nanoseconds or less, creating periodic action that allows heat dissipation between pulses. This prevents excessive heat accumulation and minimizes heat-affected zones while maintaining precise layer removal capability.
Solution Approach 2:
The patent changes the temporal parameter of laser exposure by using ultra-short pulses with width of 10 nanoseconds or less. This parameter change transforms the heating mechanism from gradual thermal diffusion to rapid localized heating followed by immediate cooling, thereby reducing carbonized foreign substances and heat-affected zones while maintaining processing precision.
2Manufacturing precision
If layers with different absorptance are processed using laser, then selective removal is improved, but optical properties of low-absorptance layers deteriorate
Solution Approach 1:
By using periodic pulsed laser irradiation with 10 nanosecond or less pulse width, the process selectively removes high-absorptance layers through rapid vaporization while allowing low-absorptance layers to retain their optical properties due to minimal energy absorption and immediate heat dissipation between pulses.
Solution Approach 2:
The patent changes the laser exposure parameters to ultra-short pulses, which exploits the difference in absorptance between layers. High-absorptance layers absorb sufficient energy for removal, while low-absorptance layers absorb minimal energy, preserving their optical properties. This parameter change enables selective processing without compromising the reliability of optical layers.
3Strength
If adhesive forces between layers are adjusted using laser, then layer bonding is improved, but additional protective layers and processing steps increase
Solution Approach 1:
The patent merges multiple functions into a single laser processing step: layer removal, heat-affected zone minimization, and interfacial adhesive force enhancement. By using ultra-short pulsed laser irradiation, the process simultaneously achieves precise material removal and controlled thermal effects that improve bonding, eliminating the need for separate protective layers and additional processing steps.
Solution Approach 2:
The laser processing method becomes multi-functional, serving both as a removal tool and a bonding enhancement tool. The ultra-short pulses enable the same laser system to selectively remove layers while simultaneously improving adhesive forces at interfaces through controlled thermal effects, reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves processing quality by minimizing heat-affected zones, reducing carbonized foreign substances, and maintaining optical properties, while reducing stress and the need for additional protective layers, thereby enhancing the manufacturing efficiency and quality of display devices.
Implementation Method 1
The first layer and the second layer may be sequentially removed by irradiating a pulsed laser beam to the processing target
Implementation Method 2
The third layer may be disposed or located between the first layer and the second layer and have an absorptance that is smaller than each of an absorptance of the first layer and an absorptance of the second layer
Data Source
AI summary
A method of manufacturing a display device includes preparing a processing target including a first layer, a second layer, and a third layer located between the first layer and the second layer and having an absorptance that is smaller than each of an absorptance of the first layer and an absorptance of the second layer, and sequentially removing the first layer and the second layer by irradiating a pulsed laser beam to the processing target.